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Results on Analog.com

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  1. 5G Drives mmWave Technology Across Multiple Industries
    Technical Articles
    Oct 1, 2019

    Keith Benson

    Industries can often benefit from technology created for a different industry’s application. The microwave oven is generally credited to an engineer working on radars who noticed his lunch was melting during testing.
  2. Integrated Hardened DSP on DAC/ADC ICs Improves Wideband Multichannel Systems
    Technical Articles
    May 1, 2021

    Michael Jones,

    Travis Collins,

    Charles Frick

    This article presents experimental results utilizing a 16-channel transmit and 16-channel receive subarray in which all transmit and receive channels are calibrated using hardened DSP blocks within the digitizer integrated circuit (IC).
  3. CN0387
    Circuits from the Lab
    Calibration-Free Return Loss Measurement System

    Documentation

  4. Gauging the State of GaN Power Amplification
    Technical Articles
    Jan 1, 2016

    Walt Demore

    Improvements in GaN power semiconductor technology and modular design are making possible high power continuous wave (CW) and pulsed amplifiers at microwave frequencies
  5. AN-827: A Resonant Approach to Interfacing Amplifiers to Switched-Capacitor ADCs
    Application Note

    PDF

    203 kB

  6. EVAL-HMC8500PM5E
    Evaluation Board & Kit
    The HMC8500PM5E evaluation board is a 2-layer board fabricated using Rogers 4350 and using best practices for high frequency RF design. The RF input and RF output traces have a 50 Ω characteristic impedance. The board is attached to a heat sink using an electrically and thermally conductive epoxy providing a low thermal and low dc resistance path. Components are mounted using SN63 solder allowing rework of the surface-mount components without compromising the …

    Documentation

  7. CN0279
    Circuits from the Lab
    High IF Sampling Receiver Front End with Band-Pass Filter

    Documentation

  8. CN0390
    Circuits from the Lab
    20 GHz to 37.5 GHz, RF Automatic Gain Control (AGC) Circuit

    Documentation

  9. EVAL-HMC1114PM5E
    Evaluation Board & Kit
    Use RF circuit design techniques for the circuit board used in the application. Provide 50 Ω impedance for the signal lines and directly connect the package ground leads and exposed paddle to the ground plane. Use a sufficient number of via holes to connect the top and bottom ground planes. The evaluation PCB is available from Analog Devices, Inc., upon request.
    EVAL-HMC1114PM5E

    Documentation

  10. ADPA9007-EVALZ
    Evaluation Board & Kit
    The EVAL-ADPA9007 consists of a 2-layer printed circuit board (PCB) fabricated from 10 mil thick Rogers 4350B copper clad mounted to an aluminum heat spreader. The heat spreader assists in providing thermal relief to the ADPA9007 and mechanical support to the PCB. The mounting holes on the heat spreader allow for attachment to larger heat sinks to improve thermal management. The RFIN and RFOUT/VDD ports are populated by 2.92 mm female …
    ADPA9007-EVALZ

    Documentation

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