Overview

Product Details

The ADRF5132-EVALZ can handle high power levels and temperatures at which the device operates.


The ADRF5132-EVALZ evaluation board is constructed with eight metal layers and dielectrics between each layer. Each metal layer has 1 oz (1.3 mil) copper thickness, whereas the external layers are 1.5 oz.


The top dielectric material is 10 mil Rogers RO4350, which exhibits a very low thermal coefficient, offering control over thermal rise of the board. The dielectrics between other metal layers are FR4. The overall board thickness achieved is 60 mil.

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Documentation & Resources

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