EVAL-ADPA7009-2
Overview
Features and Benefits
- 2-layer Rogers 4350B evaluation board with heat spreader
- End launch 1.85 mm RF connectors
- Through calibration path
Product Details
The ADPA7009-2-EVALZ consists of a 2-layer printed circuit board (PCB) fabricated from 10 mil thick Rogers 4350B copper clad mounted to an aluminum heat spreader. The heat spreader assists in providing thermal relief to the ADPA7009-2 as well as mechanical support to the PCB. Mounting holes on the heat spreader allow it to be attached to larger heat sinks for improved thermal management. The RFIN and RFOUT ports are populated by 1.85 mm female coaxial connectors, and their respective RF traces are of 50 Ω characteristic impedance. The ADPA7009-2-EVALZ is populated with components suitable for use over the entire operating temperature range of the ADPA7009.
RF traces are 50 Ω grounded coplanar waveguide. Package ground leads and the exposed pad connect directly to the ground plane. Multiple vias are used to connect the top and bottom ground planes, with particular focus on the area directly beneath the ground paddle to provide adequate electrical conduction and thermal conduction to the heat spreader.
The power supply decoupling capacitors shown in Figure 4 of the user guide represent the configuration that was used to characterize and qualify the device. It is possible to reduce the number of capacitors; however, this reduction varies by system. It is instead recommended to first remove or combine the largest capacitors that are farthest from the device.
Consult the ADPA7009 data sheet in conjunction with the user guide when working with the ADPA7009-2-EVALZ board.
Applicable Parts
Package Contents
- 2-layer Rogers 4350B evaluation board with heat spreader
Getting Started
EQUIPMENT NEEDED
- RF signal generator
- RF spectrum analyzer
- RF network analyzer
- 5 V, 1.5 A power supply
- −1.5 V, 10 mA power supply