EVAL-ADPA7002

Product Details

The ADPA7002-EVALZ evaluation board consists of a two-layer printed circuit board (PCB) fabricated from 10 mil thick, Rogers 4350 copper clad mounted to an aluminum heat sink. The heat sink assists in providing thermal relief to the device, as well as mechanical support to the PCB. Mounting holes on the heat sink allow attachment to larger heat sinks for improved thermal management. The RFIN and RFOUT ports are populated by 2.9 mm, female coaxial connectors and their respective RF traces are of 50 Ω characteristic impedance. The board is populated with components suitable for use over the entire operating temperature range of the device. To calibrate out board trace losses, a through calibration path is provided between J3 and J4. J3 and J4 must be populated with RF connectors to use the through calibration path. Power, ground, gate control voltages, and the detector output voltages are accessed through two 8-pin headers (see Table 1 for header pinout).

The RF traces are 50 Ω, grounded coplanar waveguide. The package ground leads and the exposed paddle directly connect to the ground plane. Multiple vias are used to connect the top and bottom ground planes, with particular focus on the area directly beneath the ground paddle, in order to provide adequate electrical conduction and thermal conduction to the heat sink.

The power supply decoupling capacitors on the evaluation board represent the configuration used to characterize and qualify the device. There can be scope to reduce the number of capacitors, but this varies from system to system. It is recommended to remove or combine the largest capacitors that are farthest from the device first.

For full details on the ADPA7002, see the ADPA7002 data sheet, which should be consulted in conjunction with this user guide when using these evaluation boards.