EVAL-24LFCSPEBZ
Overview
Features and Benefits
- 24-lead, 4 mm × 4 mm LFCSP evaluation board
- Easily changeable socket for the main device
- Gold pin connectors for the addition of passive components
- SMB connectors for the input and output of signals
- Additional space on board for prototyping
Product Details
The EVAL-24LFCSPEBZ enables easy evaluation of the 24-lead lead frame chip scale package (LFCSP) devices in the Switches and Multiplexers Portfolio portfolio that are purchased separately. The EVAL-24LFCSPEBZ is supplied with a socket to secure a 24-lead LFCSP device to the evaluation board without the need for soldering. In addition, there are three sets of gold pin connectors in each trace, allowing board flexibility and reusability for multiple evaluations.
Figure 1 shows the EVAL-24LFCSPEBZ. A 24-lead LFCSP device can be inserted into the socket in the center of the evaluation board. Each device pin has a corresponding 3-pin header link, from K1 to K24, that can either be connected to an external signal source by removing the corresponding link or by using the link to choose between VDD or GND. A wire screw terminal, J1, supplies the VDD and GND. The Subminiature Version B (SMB) connectors on the EVAL-24LFCSPEBZ allow additional external signals to be supplied to the device. In addition, there is a perfboard space and two 24-lead LFCSP pads (4 mm × 4 mm) available on top of the EVAL-24LFCSPEBZ for prototyping.
The full specifications of the device under test (DUT) are available in the corresponding product data sheet, which must be consulted with the EVAL-24LFCSPEBZ user guide when using the EVAL-24LFCSPEBZ.
Markets and Technologies
Applicable Parts
Getting Started
EQUIPMENT NEEDED
- Device being evaluated
- DC voltage source
- Analog signal source
- Method to measure voltage, such as a digital multimeter (DMM)