REF02
NOT RECOMMENDED FOR NEW DESIGNS+5V, +10V Precision Voltage References
- Part Models
- 25
- 1ku List Price
- Starting From $1.77
Part Details
- Pretrimmed to +5V, +10V
- Excellent Temperature Stability: 3ppm/°C (typ)
- Low Noise: 10µVP-P (REF02)
- Short-Circuit Protected
- Linear Temperature Transducer Output (REF02)
The REF01/REF02 are industry-standard precision voltage references. The stable 10V output of the REF01 can be adjusted over a ±6% range with minimal effect on temperature stability. The 5V output REF02 can also be adjusted over a ±6% range. The 10V REF01 has a single-supply operation over an input voltage range of 13V to 33V, while the 5V REF02 has a single-supply operation over an input voltage range of 7V to 33V. Both devices offer a low-current drain of 1mA. The REF02 also provides a TEMP pin whose output voltage varies linearly with temperature, making this device suitable for a wide variety of temperature-sensing and control applications. For new designs, refer to the MAX6035 or MAX6143 data sheets.
Applications
- Analog-to-Digital Converters
- Digital Voltmeters
- Digital-to-Analog Converters
- Threshold Detectors
- Voltage Regulators
Documentation
Data Sheet 2
Technical Articles 3
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| 85514012A | 20-Lead LCC | ||
| 8551401PA | 8-Lead CerDIP | ||
| REF02AJ/883C | 8-Pin TO-99 | ||
| REF02AZ | 8-Lead CerDIP | ||
| REF02AZ/883C | 8-Lead CerDIP | ||
| REF02CESA+ | Small-Outline IC, Narrow (0.15in) | ||
| REF02CESA+T | Small-Outline IC, Narrow (0.15in) | ||
| REF02CP+ | Plastic Dual-In-Line, Narrow (0.3in) | ||
| REF02CPZ | 8-Lead PDIP | ||
| REF02CSA+ | Small-Outline IC, Narrow (0.15in) | ||
| REF02CSA+T | Small-Outline IC, Narrow (0.15in) | ||
| REF02CSZ | 8-Lead SOIC | ||
| REF02CSZ-REEL | 8-Lead SOIC | ||
| REF02CSZ-REEL7 | 8-Lead SOIC | ||
| REF02EP+ | Plastic Dual-In-Line, Narrow (0.3in) | ||
| REF02EZ | 8-Lead CerDIP | ||
| REF02HP+ | Plastic Dual-In-Line, Narrow (0.3in) | ||
| REF02HPZ | 8-Lead PDIP | ||
| REF02HSA+ | Small-Outline IC, Narrow (0.15in) | ||
| REF02HSA+T | Small-Outline IC, Narrow (0.15in) | ||
| REF02HSZ | 8-Lead SOIC | ||
| REF02HZ | 8-Lead CerDIP | ||
| REF02NBC-002C | CHIPS OR DIE | ||
| REF02RC/883C | 20-Lead LCC | ||
| REF02Z | 8-Lead CerDIP |
| Part Models | Product Lifecycle | PCN |
|---|---|---|
|
Apr 9, 2018 - 16_0026 Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices |
||
| 85514012A | PRODUCTION | |
| 8551401PA | PRODUCTION | |
| REF02AJ/883C | PRODUCTION | |
| REF02AZ/883C | PRODUCTION | |
| REF02RC/883C | PRODUCTION | |
|
Sep 7, 2017 - 17_0079 Qualification of TeamQuest Technology Inc., Philippines as an Alternate Test Site for TC-Vos Testing |
||
| 85514012A | PRODUCTION | |
| 8551401PA | PRODUCTION | |
| REF02AJ/883C | PRODUCTION | |
| REF02AZ | PRODUCTION | |
| REF02AZ/883C | PRODUCTION | |
| REF02CPZ | PRODUCTION | |
| REF02CSZ-REEL | PRODUCTION | |
| REF02HPZ | PRODUCTION | |
| REF02HSZ | PRODUCTION | |
| REF02HZ | ||
| REF02NBC-002C | PRODUCTION | |
| REF02RC/883C | PRODUCTION | |
| REF02Z | ||
|
Jun 6, 2012 - 12_0066 Add capacity for Burn In of Hermetic, 883 & QMLQ/Class B devices at TSSI Cavite |
||
| 85514012A | PRODUCTION | |
| 8551401PA | PRODUCTION | |
| REF02AJ/883C | PRODUCTION | |
| REF02AZ/883C | PRODUCTION | |
| REF02RC/883C | PRODUCTION | |
|
Nov 9, 2011 - 11_0050 Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines |
||
| 85514012A | PRODUCTION | |
| 8551401PA | PRODUCTION | |
| REF02AJ/883C | PRODUCTION | |
| REF02AZ | PRODUCTION | |
| REF02AZ/883C | PRODUCTION | |
| REF02EZ | ||
| REF02HZ | ||
| REF02RC/883C | PRODUCTION | |
| REF02Z | ||
|
Nov 9, 2011 - 11_0182 Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines |
||
| 85514012A | PRODUCTION | |
| 8551401PA | PRODUCTION | |
| REF02AJ/883C | PRODUCTION | |
| REF02AZ | PRODUCTION | |
| REF02AZ/883C | PRODUCTION | |
| REF02CPZ | PRODUCTION | |
| REF02EZ | ||
| REF02HPZ | PRODUCTION | |
| REF02HZ | ||
| REF02RC/883C | PRODUCTION | |
| REF02Z | ||
|
Jun 1, 2011 - 11_0088 Top and Bottom Mark Standardization for Certain LCC (Leadless Chip Carrier) and Metal Can Packages |
||
| 85514012A | PRODUCTION | |
| REF02AJ/883C | PRODUCTION | |
| REF02RC/883C | PRODUCTION | |
|
Jul 31, 2009 - 09_0106 Removal of Die Fab Code from Topside Marking of Remaining Mil-Grade Products |
||
| 85514012A | PRODUCTION | |
| 8551401PA | PRODUCTION | |
| REF02AJ/883C | PRODUCTION | |
| REF02AZ/883C | PRODUCTION | |
| REF02RC/883C | PRODUCTION | |
|
Nov 7, 2012 - 12_0199 Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages. |
||
| 8551401PA | PRODUCTION | |
| REF02AZ | PRODUCTION | |
| REF02AZ/883C | PRODUCTION | |
| REF02EZ | ||
| REF02HZ | ||
| REF02Z | ||
|
Oct 11, 2012 - 12_0208 ADR0x and REF0x Die Revision |
||
| REF02AZ | PRODUCTION | |
| REF02CPZ | PRODUCTION | |
| REF02CSZ | PRODUCTION | |
| REF02CSZ-REEL | PRODUCTION | |
| REF02CSZ-REEL7 | PRODUCTION | |
| REF02EZ | ||
| REF02HPZ | PRODUCTION | |
| REF02HSZ | PRODUCTION | |
| REF02HZ | ||
| REF02Z | ||
|
Mar 23, 2009 - 09_0005 REF01, REF02 and REF03 Redesign: Startup Circuitry Design Improvement and Input Voltage Maximum Rating Data Sheet Change |
||
| REF02AZ | PRODUCTION | |
| REF02CPZ | PRODUCTION | |
| REF02CSZ | PRODUCTION | |
| REF02CSZ-REEL | PRODUCTION | |
| REF02CSZ-REEL7 | PRODUCTION | |
| REF02EZ | ||
| REF02HPZ | PRODUCTION | |
| REF02HSZ | PRODUCTION | |
| REF02HZ | ||
| REF02Z | ||
|
Oct 30, 2020 - 1702R2 ASSEMBLY |
||
| REF02CESA+ | PRODUCTION | |
| REF02CESA+T | PRODUCTION | |
|
Feb 6, 2015 - 1373A WAFER FAB |
||
| REF02CESA+ | PRODUCTION | |
| REF02CP+ | ||
| REF02CSA+ | PRODUCTION | |
| REF02CSA+T | PRODUCTION | |
| REF02EP+ | ||
| REF02HP+ | ||
| REF02HSA+ | PRODUCTION | |
| REF02HSA+T | PRODUCTION | |
|
Aug 19, 2009 - 07_0024 Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad |
||
| REF02CPZ | PRODUCTION | |
| REF02HPZ | PRODUCTION | |
|
May 22, 2018 - 1702N ASSEMBLY |
||
| REF02CSA+ | PRODUCTION | |
| REF02CSA+T | PRODUCTION | |
| REF02HSA+ | PRODUCTION | |
| REF02HSA+T | PRODUCTION | |
|
Nov 23, 2010 - 10_0004 Halogen Free Material Change for SOIC Narrow Body Products Assembled at Amkor |
||
| REF02CSZ | PRODUCTION | |
| REF02CSZ-REEL | PRODUCTION | |
| REF02CSZ-REEL7 | PRODUCTION | |
| REF02HSZ | PRODUCTION | |
This is the most up-to-date revision of the Data Sheet.