REF02
NOT RECOMMENDED FOR NEW DESIGNS+5V Precision Voltage Reference/Temperature Transducer
- Part Models
- 25
- 1ku List Price
- Starting From $1.77
Part Details
- High output accuracy:
5.0 V, ±0.3% maximum - Adjustable output: ± 3% minimum
- Excellent temperature stability:
8.5 ppm/°C maximum - Low noise:
15 μV p-p typical
- High supply voltage range:
up to 36 V maximum - Low supply current:
1.4 mA maximum - High load-driving capability:
10 mA maximum - Temperature output function
The REF01 / REF02 / REF03 series of precision voltage references provide a stable 10.0 V, 5.0 V, or 2.5 V output with minimal change in response to variations in supply voltage, ambient temperature or load conditions. The devices are available in 8-lead SOIC, PDIP, CERDIP, and TO-99 packages, as well as 20-terminal LCC packages (883 only), furthering the usability of the devices in both standard and high stress applications.
With an external buffer and a simple resistor network, the TEMP terminal can be used for temperature sensing and approximation. A TRIM terminal is also provided on the device for fine adjustment of the output voltage.
The small footprint, wide supply range, and application versatility make the REF0x series of references ideal for general-purpose and space-constrained applications.
Newer designs should use the ADR01 / ADR02 / ADR03 / ADR06 series of references, which offer higher accuracy and temperature stability over a wider operating temperature range, while maintaining full pin-for-pin compatibility with the REF01 / REF02 / REF03 series. This data sheet applies to commercial-grade products only. Contact sales or visit analog.com for military-grade (883) data sheets.
APPLICATION
- Precision data systems
- High resolution converters
- Industrial process control systems
- Precision instruments
- Military and aerospace applications
| Device Number | Output Voltage | Input Voltage Range |
| REF01 |
10.0 V |
12 V to 36 V |
| REF02 |
5.0 V |
7.0 V to 36 V |
| REF03 |
2.5 V |
4.5 V to 36 V |
Documentation
Data Sheet 2
Reliability Data 1
Application Note 1
Frequently Asked Question 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| 85514012A | 20-Lead LCC | ||
| 8551401PA | 8-Lead CerDIP | ||
| REF02AJ/883C | 8-Pin TO-99 | ||
| REF02AZ | 8-Lead CerDIP | ||
| REF02AZ/883C | 8-Lead CerDIP | ||
| REF02CESA+ | Small-Outline IC, Narrow (0.15in) | ||
| REF02CESA+T | Small-Outline IC, Narrow (0.15in) | ||
| REF02CP+ | Plastic Dual-In-Line, Narrow (0.3in) | ||
| REF02CPZ | 8-Lead PDIP | ||
| REF02CSA+ | Small-Outline IC, Narrow (0.15in) | ||
| REF02CSA+T | Small-Outline IC, Narrow (0.15in) | ||
| REF02CSZ | 8-Lead SOIC | ||
| REF02CSZ-REEL | 8-Lead SOIC | ||
| REF02CSZ-REEL7 | 8-Lead SOIC | ||
| REF02EP+ | Plastic Dual-In-Line, Narrow (0.3in) | ||
| REF02EZ | 8-Lead CerDIP | ||
| REF02HP+ | Plastic Dual-In-Line, Narrow (0.3in) | ||
| REF02HPZ | 8-Lead PDIP | ||
| REF02HSA+ | Small-Outline IC, Narrow (0.15in) | ||
| REF02HSA+T | Small-Outline IC, Narrow (0.15in) | ||
| REF02HSZ | 8-Lead SOIC | ||
| REF02HZ | 8-Lead CerDIP | ||
| REF02NBC-002C | CHIPS OR DIE | ||
| REF02RC/883C | 20-Lead LCC | ||
| REF02Z | 8-Lead CerDIP |
| Part Models | Product Lifecycle | PCN |
|---|---|---|
|
Apr 9, 2018 - 16_0026 Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices |
||
| 85514012A | PRODUCTION | |
| 8551401PA | PRODUCTION | |
| REF02AJ/883C | PRODUCTION | |
| REF02AZ/883C | PRODUCTION | |
| REF02RC/883C | PRODUCTION | |
|
Sep 7, 2017 - 17_0079 Qualification of TeamQuest Technology Inc., Philippines as an Alternate Test Site for TC-Vos Testing |
||
| 85514012A | PRODUCTION | |
| 8551401PA | PRODUCTION | |
| REF02AJ/883C | PRODUCTION | |
| REF02AZ | PRODUCTION | |
| REF02AZ/883C | PRODUCTION | |
| REF02CPZ | PRODUCTION | |
| REF02CSZ-REEL | PRODUCTION | |
| REF02HPZ | PRODUCTION | |
| REF02HSZ | PRODUCTION | |
| REF02HZ | ||
| REF02NBC-002C | PRODUCTION | |
| REF02RC/883C | PRODUCTION | |
| REF02Z | ||
|
Jun 6, 2012 - 12_0066 Add capacity for Burn In of Hermetic, 883 & QMLQ/Class B devices at TSSI Cavite |
||
| 85514012A | PRODUCTION | |
| 8551401PA | PRODUCTION | |
| REF02AJ/883C | PRODUCTION | |
| REF02AZ/883C | PRODUCTION | |
| REF02RC/883C | PRODUCTION | |
|
Nov 9, 2011 - 11_0050 Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines |
||
| 85514012A | PRODUCTION | |
| 8551401PA | PRODUCTION | |
| REF02AJ/883C | PRODUCTION | |
| REF02AZ | PRODUCTION | |
| REF02AZ/883C | PRODUCTION | |
| REF02EZ | ||
| REF02HZ | ||
| REF02RC/883C | PRODUCTION | |
| REF02Z | ||
|
Nov 9, 2011 - 11_0182 Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines |
||
| 85514012A | PRODUCTION | |
| 8551401PA | PRODUCTION | |
| REF02AJ/883C | PRODUCTION | |
| REF02AZ | PRODUCTION | |
| REF02AZ/883C | PRODUCTION | |
| REF02CPZ | PRODUCTION | |
| REF02EZ | ||
| REF02HPZ | PRODUCTION | |
| REF02HZ | ||
| REF02RC/883C | PRODUCTION | |
| REF02Z | ||
|
Jun 1, 2011 - 11_0088 Top and Bottom Mark Standardization for Certain LCC (Leadless Chip Carrier) and Metal Can Packages |
||
| 85514012A | PRODUCTION | |
| REF02AJ/883C | PRODUCTION | |
| REF02RC/883C | PRODUCTION | |
|
Jul 31, 2009 - 09_0106 Removal of Die Fab Code from Topside Marking of Remaining Mil-Grade Products |
||
| 85514012A | PRODUCTION | |
| 8551401PA | PRODUCTION | |
| REF02AJ/883C | PRODUCTION | |
| REF02AZ/883C | PRODUCTION | |
| REF02RC/883C | PRODUCTION | |
|
Nov 7, 2012 - 12_0199 Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages. |
||
| 8551401PA | PRODUCTION | |
| REF02AZ | PRODUCTION | |
| REF02AZ/883C | PRODUCTION | |
| REF02EZ | ||
| REF02HZ | ||
| REF02Z | ||
|
Oct 11, 2012 - 12_0208 ADR0x and REF0x Die Revision |
||
| REF02AZ | PRODUCTION | |
| REF02CPZ | PRODUCTION | |
| REF02CSZ | PRODUCTION | |
| REF02CSZ-REEL | PRODUCTION | |
| REF02CSZ-REEL7 | PRODUCTION | |
| REF02EZ | ||
| REF02HPZ | PRODUCTION | |
| REF02HSZ | PRODUCTION | |
| REF02HZ | ||
| REF02Z | ||
|
Mar 23, 2009 - 09_0005 REF01, REF02 and REF03 Redesign: Startup Circuitry Design Improvement and Input Voltage Maximum Rating Data Sheet Change |
||
| REF02AZ | PRODUCTION | |
| REF02CPZ | PRODUCTION | |
| REF02CSZ | PRODUCTION | |
| REF02CSZ-REEL | PRODUCTION | |
| REF02CSZ-REEL7 | PRODUCTION | |
| REF02EZ | ||
| REF02HPZ | PRODUCTION | |
| REF02HSZ | PRODUCTION | |
| REF02HZ | ||
| REF02Z | ||
|
Oct 30, 2020 - 1702R2 ASSEMBLY |
||
| REF02CESA+ | PRODUCTION | |
| REF02CESA+T | PRODUCTION | |
|
Feb 6, 2015 - 1373A WAFER FAB |
||
| REF02CESA+ | PRODUCTION | |
| REF02CP+ | ||
| REF02CSA+ | PRODUCTION | |
| REF02CSA+T | PRODUCTION | |
| REF02EP+ | ||
| REF02HP+ | ||
| REF02HSA+ | PRODUCTION | |
| REF02HSA+T | PRODUCTION | |
|
Aug 19, 2009 - 07_0024 Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad |
||
| REF02CPZ | PRODUCTION | |
| REF02HPZ | PRODUCTION | |
|
May 22, 2018 - 1702N ASSEMBLY |
||
| REF02CSA+ | PRODUCTION | |
| REF02CSA+T | PRODUCTION | |
| REF02HSA+ | PRODUCTION | |
| REF02HSA+T | PRODUCTION | |
|
Nov 23, 2010 - 10_0004 Halogen Free Material Change for SOIC Narrow Body Products Assembled at Amkor |
||
| REF02CSZ | PRODUCTION | |
| REF02CSZ-REEL | PRODUCTION | |
| REF02CSZ-REEL7 | PRODUCTION | |
| REF02HSZ | PRODUCTION | |
This is the most up-to-date revision of the Data Sheet.
Hardware Ecosystem
| Parts | Product Life Cycle | Description |
|---|---|---|
| ADR02 | PRODUCTION | Ultracompact, Precision 5.0 V Voltage Reference |