MAX6023
PRODUCTIONPrecision, Low-Power, Low-Dropout, UCSP Voltage Reference
- Part Models
- 8
- 1ku List Price
- Starting From $1.80
Part Details
The MAX6023 is a family of low-dropout, micropower voltage references in a 5-bump, chip-scale package (UCSP™). The MAX6023 series-mode (three-terminal) references, which operate with input voltages from 2.5V to 12.6V (1.25V and 2.048V options) or (VOUT + 0.2V) to 12.6V (all other voltage options), are available with output voltage options of 1.25V, 2.048V, 2.5V, 3.0V, 4.096V, 4.5V, and 5.0V. These devices are guaranteed an initial accuracy of ±0.2% and 30ppm/°C temperature drift over the -40°C to +85°C extended temperature range.
UCSPs offer the benefit of moving to smaller footprint and lower profile devices, significantly smaller than even SC70 or SOT23 plastic surface-mount packages. The significantly lower profile (compared to plastic SMD packages) of the UCSP makes the device ideal for height-critical applications. Miniature UCSP packages also enable device placement close to sources and allow more flexibility in a complex or large design layout.
The MAX6023 voltage references use only 27µA of supply current. And unlike shunt-mode (two-terminal) references, the supply current of the MAX6023 family varies only 0.8µA/V with supply-voltage changes, translating to longer battery life. Additionally, these internally compensated devices do not require an external compensation capacitor and are stable up to 2.2nF of load capacitance. The low-dropout voltage and the low supply current make these devices ideal for battery-operated systems.
Applications
- Battery-Operated Equipment
- Data Acquisition Systems
- Handheld Equipment
- Hard-Disk Drives
- Industrial and Process Control Systems
Documentation
Data Sheet 1
Reliability Data 1
Design Note 3
Technical Articles 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| MAX6023EBT12+ | N/A | ||
| MAX6023EBT12+T | N/A | ||
| MAX6023EBT21+ | N/A | ||
| MAX6023EBT21+T | N/A | ||
| MAX6023EBT25+ | N/A | ||
| MAX6023EBT25+T | N/A | ||
| MAX6023EBT30+ | N/A | ||
| MAX6023EBT30+T | N/A |
| Part Models | Product Lifecycle | PCN |
|---|---|---|
|
Jul 19, 2016 - 1594_AMENDED ASSEMBLY |
||
| MAX6023EBT12+ | PRODUCTION | |
| MAX6023EBT12+T | PRODUCTION | |
| MAX6023EBT25+T | PRODUCTION | |
| MAX6023EBT30+T | PRODUCTION | |
|
Dec 8, 2015 - 1594_PRE-PCN WAFER FAB |
||
| MAX6023EBT12+ | PRODUCTION | |
| MAX6023EBT12+T | PRODUCTION | |
| MAX6023EBT25+T | PRODUCTION | |
| MAX6023EBT30+T | PRODUCTION | |
This is the most up-to-date revision of the Data Sheet.
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