DS1856M
NOT RECOMMENDED FOR NEW DESIGNSDual, Temperature-Controlled Resistors with Calibrated Monitors and Password Protection
Drop In for Industry Leader DS1856 with 256 Byte A0 Memory
- Part Models
- 4
- 1ku List Price
- Starting From $2.08
Part Details
- SFF-8472 Compatible
- 13-Bit ADC
- Two Linear, 256-Position, Nonvolatile Temperature-Controlled Variable Resistors with 2°C Resolution
- Three Levels of Security
- Access to Monitoring and ID Information Configurable with Separate Device Addresses
- 2-Wire Serial Interface
- Two Buffers with TTL/CMOS-Compatible Inputs and Open-Drain Outputs
- Operates from a 3.3V or 5V Supply
- -40°C to +95°C Operating Temperature Range
The DS1856M dual, temperature-controlled, nonvolatile (NV) variable resistors with three monitors consists of two 256-position, linear, variable resistors; three analog monitor inputs (MON1, MON2, MON3); and a direct-to-digital temperature sensor. The device provides an ideal method for setting and temperature-compensating bias voltages and currents in control applications using minimal circuitry. The variable resistor settings are stored in EEPROM memory and can be accessed over the 2-wire serial bus.
The DS1856M includes 128 bytes of EEPROM memory at A2h slave address, Table 00/01. The DS1856M also includes three-levels of password protection. The DS1856-01 includes 256 bytes of A0h EEPROM memory. The DS1856B-M50+ and DS1856E-M50+ are drop-in replacements for the DS1856B-050+ and DS1866E-050+, respectively. The enhancements include 256 bytes of EEPROM at A0h; selectable MON2, MON3 references; and a 13-bit ADC. These are backward compatible by default with the DS1856B-050+/DS1856E-050+.
Applications
- Diagnostic Monitoring
- Instrumentation and Industrial Controls
- Optical Transceivers
- Optical Transponders
- RF Power Amps
Documentation
Data Sheet 1
Reliability Data 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| DS1856B-M50+ | Chip-Scale Ball-Grid Array | ||
| DS1856B-M50+T&R | Chip-Scale Ball-Grid Array | ||
| DS1856E-M50+ | Thin Shrink Small-Outline Package | ||
| DS1856E-M50+T&R | Thin Shrink Small-Outline Package |
| Part Models | Product Lifecycle | PCN |
|---|---|---|
|
Dec 11, 2018 - 1754N ASSEMBLY |
||
| DS1856E-M50+ | PRODUCTION | |
| DS1856E-M50+T&R | PRODUCTION | |
This is the most up-to-date revision of the Data Sheet.
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