ADSP-21060L
NOT RECOMMENDED FOR NEW DESIGNSSHARC, 120 MFLOPS, 3.3 v, floating point
- Part Models
- 2
- 1ku List Price
- price unavailable
Part Details
- 40MHz (25ns instruction rate) SISD SHARC Core
- 120MFLOPs peak performance
- Code compatible with all SHARC processors
- Supports IEEE-compatible 32-bit floating-point, 40-bit floating point, and 32-bit fixed point math
- Glueless connection for scalable DSP multiprocessing
- 4Mbits of on-chip dual-ported SRAM
- Six Link Ports for point to point connectivity and array multiprocessing
- Two synchronous serial ports with independent transmit and receive functions
- 10 Channel DMA controller
- Host Processor Interface
The ADSP-21062 and ADSP-21060 SHARC DSPs are signal processing microcomputers that offer new capabilities and levels of performance. The ADSP-2106x SHARCs are 32-bit processors optimized for high performance DSP applications. The ADSP-2106x builds on the ADSP-21000 DSP core to form a complete system-on-a-chip, adding a dual-ported on-chip SRAM and integrated I/O peripherals supported by a dedicated I/O bus.
Fabricated in a high speed, low power CMOS process, the ADSP-2106x has a 25 ns instruction cycle time and operates at 40 MIPS. With its on-chip instruction cache, the processor can execute every instruction in a single cycle.
The ADSP-2106x SHARC DSP represents a new standard of integration for signal computers, combining a high performance floating-point DSP core with integrated, on-chip system features including a 4 Mbit SRAM memory (2 Mbit on the ADSP-21062, 1 Mbit on the ADSP-21061), host processor interface, DMA controller, serial ports, and link port and parallel bus connectivity for glueless DSP multiprocessing.
Documentation
Data Sheet 1
Application Note 38
Processor Manual 2
Integrated Circuit Anomaly 1
Legacy Emulator Manual 2
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
---|---|---|---|
ADSP-21060LABZ-160 | 225-Ball PBGA (23mm x 20mm) | ||
ADSP-21060LCW-160 | 240-Lead CQFP, Heat Slug Down |
Part Models | Product Lifecycle | PCN |
---|---|---|
Aug 23, 2023 - 23_0004 Assembly Site Transfer of Select PBGA Products to ASE Kaohsiung (AEG) |
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ADSP-21060LABZ-160 | ||
Jul 14, 2021 - 20_0165 Assembly Transfer of Select PBGA Products to ASE Chungli (AET) |
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ADSP-21060LABZ-160 | ||
Jun 18, 2010 - 07_0093 Conversion to Laser Mark for all ADSPXXXX, ADSSTXXXX, and PC Audio Codecs Ink on Plastic Encapsulated Parts |
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ADSP-21060LABZ-160 | ||
ADSP-21060LCW-160 | PRODUCTION | |
Oct 18, 2023 - 23_0154 ADSP-21060/ADSP-21060L Ink Mark to Laser Mark Conversion CQFP Products |
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ADSP-21060LCW-160 | PRODUCTION | |
Jul 13, 2018 - 17_0086 ADSP21060 CQFP Assembly Transfer to Rochester Electronics |
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ADSP-21060LCW-160 | PRODUCTION | |
Jun 16, 2009 - 09_0027 Conversion to Laser Mark for the LQFP Packages (Single Grades) |
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ADSP-21060LCW-160 | PRODUCTION | |
Dec 12, 2022 - 22_0066 Obsolescence of SHARC Processor products |
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ADSP-21060LABZ-160 |
This is the most up-to-date revision of the Data Sheet.
Software Resources
Software & Tools Anomaly 1
Evaluation Software 0
Tools & Simulations
BSDL Model File 3
Designing with BGA
Surface Mount Assembly Recommendations for Plastic Ball Grid Array (PBGA) Packages
Open ToolIBIS Model 4
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