ADSD3100

RECOMMENDED FOR NEW DESIGNS

1 MP, CMOS, Time of Flight, Backside Illumination Sensor

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2
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Part Details

  • 1024 (horizonal) × 1024 (vertical) pixel array
  • 3.5 μm × 3.5 μm square pixels
  • 1/3.6 inch optical format
  • 4-wire SPI or 2-wire I2C serial interface
  • Die size: 5.364 mm × 9.799 mm
  • MIPI CSI-2 transmitter interface with support for 1, 2, or 4 data lanes, programmable up to 1.5 Gbps per lane
  • Dual, 3.3 V and 1.27 V external supplies, 1.8 V I/O section
ADSD3100
1 MP, CMOS, Time of Flight, Backside Illumination Sensor
ADSD3100 Chip Image ADSD3100 Functional Block Diagram
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