ADP5030

PRODUCTION

Dual, 200 mA, High Performance RF LDO with Load Switch

Data Sheet (Rev. B) Product Selection Table

Part Models: 1
1ku List Price: Starting From $1.03

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Part Details

Input voltage range: 2.5 V to 5.5 V
Dual, 200 mA low dropout voltage regulators
Tiny, 16-ball, 1.6 mm × 1.6 mm WLCSP
Initial accuracy: ±0.7%

Stable with 1 μF ceramic output capacitors
Overcurrent and thermal protection
High PSRR
See data sheet for additional features.

Part Models: 1
1ku List Price: Starting From $1.03

Documentation

Data Sheet 1

ADP5030: Dual, 200 mA, High Performance RF LDO with Load Switch Data Sheet (Rev.B) 11/30/2009

Application Note 1

AN-1072: How to Successfully Apply Low Dropout Regulators 04/27/2010

Frequently Asked Question 1

FAQ 06/17/2015

ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.

Part Model	Pin/Package Drawing	Documentation	CAD Symbols, Footprints, and 3D Models
ADP5030ACBZ-1228R7	16-Ball WLCSP (1.56mm x 1.56mm)	Material Declaration Reliablity Data	Ultra Librarian SamacSys

Part Models	Product Lifecycle	PCN

May 23, 2012 - 10_0047 TSMC Fab 10 Qualification for LD20 Process
		PCN10_0047_Form Material_Report
ADP5030ACBZ-1228R7	PRODUCTION	PCN10_0047_Form Material_Report
Feb 28, 2012 - 11_0175 Shipping Changes for WLCSP Products with 8mm Carrier Tape Width
		PCN11_0175_Form Material_Report Qualification Report Summary Detailed Parts List
ADP5030ACBZ-1228R7	PRODUCTION
Jul 2, 2010 - 10_0167 Addition of reel supplier ePAK for WLCSP products at JCAP
		PCN10_0167_Form Material_Report Reliability Report
ADP5030ACBZ-1228R7	PRODUCTION	PCN10_0167_Form Material_Report Reliability Report
Apr 20, 2010 - 09_0260 Addition of JCAP as an alternate source and transfer to JCAP for Wafer Bumping Process.
		PCN09_0260_Form Material_Report Reliability Report Reliability Report
ADP5030ACBZ-1228R7	PRODUCTION

This is the most up-to-date revision of the Data Sheet.

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