ADN2855
PRODUCTIONMultirate 155 Mbps/622 Mbps/1244 Mbps/1250 Mbps Burst Mode Clock and Data Recovery IC with Deserializerer
- Part Models
- 2
- 1ku List Price
- price unavailable
Part Details
- Serial data input
- 155.52 Mbps/622.08 Mbps/1244.16 Mbps/1250.00 Mbps
- 12-bit acquisition time
- 4-bit parallel LVDS output interface
- Patented dual-loop clock recovery architecture
- Integrated PRBS generator
- Byte rate reference clock
- Loss-of-lock indicator
- Supports double data rate (DDR)-compatible FPGA
- I2C interface to access optional features
- Single-supply operation: 3.3 V
- Power
- 670 mW typical in serial output mode
- 825 mW typical in deserializer mode
- 5 mm × 5 mm, 32-lead LFCSP
The ADN2855 is a burst mode clock and data recovery IC designed for GPON/BPON/GEPON optical line terminal (OLT) receiver applications. The part can operate at 155.52 Mbps, 622.08 Mbps, 1244.16 Mbps, or 1250.00 Mbps data rates, selectable via the I2C interface.
The ADN2855 frequency locks to the OLT reference clock and aligns to the input data within 12 bits of the start of the preamble. The device provides a full rate or an optional half rate output clock for a double data rate (DDR) interface to an FPGA or digital ASIC.
All specifications are quoted for −40°C to +85°C ambient temperature, unless otherwise noted. The ADN2855 is available in a compact 5 mm × 5 mm, 32-lead chip scale package.
Applications
- Passive optical networks
- GPON/BPON/GEPON OLT receivers
Documentation
Data Sheet 1
Frequently Asked Question 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| ADN2855ACPZ | 32-Lead LFCSP (5mm x 5mm w/ EP) | ||
| ADN2855ACPZ-R7 | 32-Lead LFCSP (5mm x 5mm w/ EP) |
| Part Models | Product Lifecycle | PCN |
|---|---|---|
|
Oct 21, 2016 - 16_0229 Assembly Transfer of Select LFCSP Products to ASE Korea |
||
| ADN2855ACPZ | PRODUCTION | |
| ADN2855ACPZ-R7 | PRODUCTION | |
|
May 11, 2014 - 13_0231 Assembly Transfer of Select 4x4 and 5x5mm LFCSP Products to STATS ChipPAC China. |
||
| ADN2855ACPZ | PRODUCTION | |
| ADN2855ACPZ-R7 | PRODUCTION | |
|
Jul 16, 2012 - 11_0020 Conversion of Select Sizes of LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to StatsChippac Malaysia. |
||
| ADN2855ACPZ | PRODUCTION | |
| ADN2855ACPZ-R7 | PRODUCTION | |
|
Feb 15, 2010 - 07_0061 LFCSP Package Manufacturing Line Transfer from Amkor Korea to Amkor PRC |
||
| ADN2855ACPZ | PRODUCTION | |
| ADN2855ACPZ-R7 | PRODUCTION | |
This is the most up-to-date revision of the Data Sheet.
Evaluation Kits
ADN2855 Evaluation Board