ADN2847
ADN2847
Obsolete3.3 V Dual-Loop 50 Mbps to 3.3 Gbps Laser Diode Driver
- Part Models
- 1
- 1ku List Price
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Part Details
- 50 Mbps to 3.3 Gbps operation
- Single 3.3 V operation
- Typical rise/fall time: 80 ps
- Bias current range: 2 mA to 100 mA
- Modulation current range: 5 mA to 80 mA
- Monitor photodiode current: 50 µA to 1200 µA
- Dual MPD functionality for DWDM
- 50 mA supply current at 3.3 V
- Closed-loop control of power and extinction ratio
- Full current parameter monitoring
- Laser fail and laser degrade alarms
- Automatic laser shutdown (ALS)
The ADN2847 uses a unique control algorithm to control both average power and extinction ratio of the laser diode (LD) after initial factory setup. External component count and PCB area are low, as both power and extinction ratio control are fully integrated. Programmable alarms are provided for laser fail (end of life) and laser degrade (impending fail).
Optional dual MPD current monitoring is designed into the ADN2847 specifically for DWDM wavelength control.
The ADN2847 is specified for the −40°C to +85°C temperature range and is available in a 48-lead LFCSP package and a 32-lead LFCSP package.
APPLICATIONS
- SONET OC-1/3/12/48
- SDH STM-0/1/4/16
- Fibre Channel
- Gigabit Ethernet
- DWDM dual MPD wavelength control
Documentation
Data Sheet 1
Application Note 4
Technical Articles 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
---|---|---|---|
ADN2847ACPZ-32-RL | 32-Lead LFCSP (5mm x 5mm) |
Part Models | Product Lifecycle | PCN |
---|---|---|
Dec 10, 2014 - 14_0049 Conversion of 6x6mm and 7x7mm LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines |
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ADN2847ACPZ-32-RL | Obsolete | |
Mar 23, 2012 - 11_0104 Conversion of Select Sizes of LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to ASE-Korea. |
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ADN2847ACPZ-32-RL | Obsolete | |
Jan 29, 2014 - 14_0014 ADI Corporate Obsolescence Notice-January 2014 (Standard Products) |
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ADN2847ACPZ-32-RL | Obsolete |
This is the most up-to-date revision of the Data Sheet.