ADN2841
NOT RECOMMENDED FOR NEW DESIGNSDual-Loop, 50 Mbps to 2.7 Gbps Laser Diode Driver
- Part Models
- 4
- 1ku List Price
- price unavailable
Part Details
- 50 Mbps to 2.7 Gbps operation
- Typical rise/fall time: 80 ps
- Bias current range: 2 mA to 100 mA
- Modulation current range: 5 mA to 80 mA
- Monitor photodiode current: 50 μA to 1200 μA
- Closed-loop control of power and extinction ratio
- Laser fail and laser degrade alarms
- Automatic laser shutdown (ALS)
- Dual MPD functionality for DWDM
- Optional clocked data
- Full current parameter monitoring
- 5 V operation
- 48-lead LFCSP
- 32-lead LFCSP (reduced functionality)
The ADN2841 uses a unique control algorithm to control both the average power and extinction ratio of the laser diode (LD) after initial factory setup. Because power and extinction ratio control are fully integrated, external component count is low and PCB area is small. Programmable alarms are provided for laser fail (end of life) and laser degrade (impending fail).
The ADN2841 has circuitry for a second monitor photodiode, which enables DWDM wavelength control.
Applications
- DWDM dual MPD wavelength fixing
- SONET OC-1/3/12/48
- SDH STM-1/4/16
- Fibre Channel
- Gigabit Ethernet
Documentation
Data Sheet 1
Application Note 4
Technical Articles 1
Analog Dialogue 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| ADN2841ACPZ-32 | 32-Lead LFCSP (5mm x 5mm w/ EP) | ||
| ADN2841ACPZ-32-RL7 | 32-Lead LFCSP (5mm x 5mm w/ EP) | ||
| ADN2841ACPZ-48 | 48-Lead LFCSP (7mm x 7mm x 0.85mm w/ EP) | ||
| ADN2841ACPZ-48-RL | 48-Lead LFCSP (7mm x 7mm x 0.85mm w/ EP) |
| Part Models | Product Lifecycle | PCN |
|---|---|---|
|
Dec 10, 2014 - 14_0049 Conversion of 6x6mm and 7x7mm LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines |
||
| ADN2841ACPZ-32 | ||
| ADN2841ACPZ-32-RL7 | ||
|
Mar 23, 2012 - 11_0104 Conversion of Select Sizes of LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to ASE-Korea. |
||
| ADN2841ACPZ-32 | ||
| ADN2841ACPZ-32-RL7 | ||
|
Oct 28, 2009 - 08_0008 Qualification of 8" 0.6um BiCMOS wafer fab process at Analog Devices, Limerick, Ireland. |
||
| ADN2841ACPZ-32 | ||
| ADN2841ACPZ-32-RL7 | ||
| ADN2841ACPZ-48 | ||
| ADN2841ACPZ-48-RL | ||
|
Apr 29, 2015 - 14_0049 Conversion of 6x6mm and 7x7mm LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines |
||
| ADN2841ACPZ-48 | ||
| ADN2841ACPZ-48-RL | ||
This is the most up-to-date revision of the Data Sheet.
Software Resources
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