HMC7150
RECOMMENDED FOR NEW DESIGNS28 Gbps EML Driver
- Part Models
- 2
- 1ku List Price
- price unavailable
Part Details
- Operation up to 28.3 Gbps
- Low DC Power Dissipation, 0.12W for 1.5VP-P swing @ 3.3V supply 0.50W for 2.3Vpp swing @ 6V supply
- Adjustable Output Amplitude from 1.2VP-P to 2.3VP-P
- 16 Lead 3x3mm SMT Package: <9 mm2
The HMC7150 is a broadband driver amplifier for electro-absorption modulated lasers (EML) and supports data-rates up to 28.3Gbps to meet the 100Gb Ethernet system requirements. The part provides the module designers scalable power dissipation for varying drive voltage characteristics of different modulators and the power consumption of the module can be set as low as 0.12W to 0.5W at 1.5VP-P and 2.3VP-P outputs amplitudes, respectively. The HMC7150 supports wide range of supply voltages from 3.3V to 6V and delivering excellent time domain performance. The output amplitude and cross-point can be adjusted via control pins. The input and output are 50 Ohms matched and used AC coupled. The HMC7150 is in compact leadless 3x3mm surface mountable package.
APPLICATIONS
- 100Gb Ethernet ER4/ LR4 systems
- CFP/CFP2/CFP4 or similar form factor modules
- Optical transceivers and pluggable modules
- Broadband gain stages and pre-amplifiers
- Broadband Test & Measurement Equipment
Documentation
Request an NDA
Complete documentation is available upon completion of a Non-Disclosure Agreement (NDA).
Request an NDAQuality Documentation 2
Tape & Reel Specification 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| HMC7150LP3DE | LFCSP:LEADFRM CHIP SCALE | ||
| HMC7150LP3DETR | LFCSP:LEADFRM CHIP SCALE |
| Part Models | Product Lifecycle | PCN |
|---|---|---|
|
Mar 29, 2023 - 22_0048 Addition of ASE Korea as an Alternate Assembly Site for Select LFCSP Products |
||
| HMC7150LP3DE | PRODUCTION | |
| HMC7150LP3DETR | PRODUCTION | |
Evaluation Kits
HMC7150LP3D Evaluation Board