概览

产品详情

The circuit board used in the application should use RF circuit design techniques. signal lines should have 50 Ohm impedance while the package ground leads and exposed ground paddle should be connected directly to the ground plane similar to that shown. A sufficient number of via holes should be used to connect the top and bottom ground planes.

技术与领域

相关产品

文档

  • 查看全部 (1)
  • 评估设计文件 (1)
    • Document Type