ADG419

量产

LC²MOS 精密模拟开关，采用小型DIP封装

数据手册 (Rev. B) 产品选型表

产品模型: 9

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产品详情

最大额定电源电压：44 V
模拟信号范围：V_SS 至 V_DD
低导通电阻：<35 Ω
超低功耗：< 35 μW
快速转换时间：160 ns（最大值）
先开后合式开关动作
DG419的直接替代产品

ADG419-EP支持防务和航空航天应用（AQEC标准）。

下载ADG419-EP 数据手册(pdf)
军用温度范围：-55℃至+125℃
受控制造基线
唯一封装/测试厂
唯一制造厂
增强型产品变更通知
认证数据可应要求提供
V62/10615 DSCC图纸号

产品模型: 9

参考资料

ADI 始终高度重视提供符合最高质量和可靠性水平的产品。我们通过将质量和可靠性检查纳入产品和工艺设计的各个范围以及制造过程来实现这一目标。出货产品的“零缺陷”始终是我们的目标。查看我们的质量和可靠性计划和认证以了解更多信息。

产品型号	引脚/封装图-中文版	文档	CAD 符号，脚注和 3D模型
ADG419BNZ	8-Lead PDIP	Material Declaration Reliablity Data	Ultra Librarian SamacSys
ADG419BRMZ	8-Lead MSOP	Material Declaration Reliablity Data	Ultra Librarian SamacSys
ADG419BRMZ-REEL	8-Lead MSOP	Material Declaration Reliablity Data	Ultra Librarian SamacSys
ADG419BRMZ-REEL7	8-Lead MSOP	Material Declaration Reliablity Data	Ultra Librarian SamacSys
ADG419BRZ	8-Lead SOIC	Material Declaration Reliablity Data	Ultra Librarian SamacSys
ADG419BRZ-REEL	8-Lead SOIC	Material Declaration Reliablity Data	Ultra Librarian SamacSys
ADG419BRZ-REEL7	8-Lead SOIC	Material Declaration Reliablity Data	Ultra Librarian SamacSys
ADG419SRMZ-EP-RL7	8-Lead MSOP	Material Declaration Reliablity Data	Ultra Librarian SamacSys
ADG419TQ	8-Lead CerDIP	Material Declaration Reliablity Data	Ultra Librarian SamacSys

产品型号	产品生命周期	PCN

2月 8, 2010 - 04_0080 Qualification of the 8" C6 and Q Wafer Fab Processes at Analog Devices, Limerick, Ireland.
		PCN04_0080_Form Material_Report Reliability Report Reliability Report
ADG419BNZ
ADG419BRMZ
ADG419BRMZ-REEL
ADG419BRMZ-REEL7
ADG419BRZ	量产
ADG419BRZ-REEL	量产
ADG419BRZ-REEL7	量产
8月 19, 2009 - 07_0024 Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad
		Material_Report Material_Report Parts List PCN07_0024_Form Qual Data
ADG419BNZ
3月 22, 2021 - 21_0001 Addition of Amkor Philippines as an Alternate Site for Singulated MSOP and MSOP_EP
		PCN21_0001_Form Material_Report Other Qualification Results Summary
ADG419BRMZ
ADG419BRMZ-REEL
ADG419BRMZ-REEL7
1月 5, 2015 - 14_0246 Qualification of ASE Chungli, as an Alternate Assembly Site for Select MSOP Devices
		PCN14_0246_Form Material_Report Detailed Change Description Qualification Results Summary
ADG419BRMZ
ADG419BRMZ-REEL
ADG419BRMZ-REEL7
5月 15, 2012 - 10_0006 Halogen Free Material Change for mini SOIC Products
		PCN10_0006_Form Material_Report Qualification Report Summary Qualification Report Summary
ADG419BRMZ
ADG419BRMZ-REEL
ADG419BRMZ-REEL7
ADG419SRMZ-EP-RL7	量产
7月 20, 2012 - 12_0105 Halogen Free Material Change for Select SOIC Narrow and Wide Body Products Assembled at Amkor
		PCN12_0105_Form Material_Report Qualification Report Summary
ADG419BRZ	量产
ADG419BRZ-REEL	量产
ADG419BRZ-REEL7	量产
3月 11, 2019 - 18_0209 ADG419-EP Re-design with Wafer Fabrication Transfer
		PCN18_0209_Form Material_Report Qualification Results Summary
ADG419SRMZ-EP-RL7	量产
6月 24, 2019 - 19_0113 ADG419TQ Re-design with Wafer Fabrication Transfer
		PCN19_0113_Form Material_Report Qualification Results Summary
ADG419TQ	量产
11月 7, 2012 - 12_0199 Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.
		PCN12_0199_Form Material_Report Qualification Report Summary Datasheet Specification Comparison
ADG419TQ	量产
11月 9, 2011 - 11_0050 Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines
		PCN11_0050_Form Material_Report
ADG419TQ	量产	PCN11_0050_Form Material_Report
11月 9, 2011 - 11_0182 Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines
		PCN11_0182_Form Material_Report
ADG419TQ	量产	PCN11_0182_Form Material_Report