ADSP-BF70x Series

Designed For A Wide Variety of Applications

Intelligent Lighting & Occupancy Detection Industrial Imaging: 
  • Portable Barcode scanners
  • Biometrics – fingerprint
  • Entry-level CMOS camera
Portable Pro Audio
  • Effects pedals, voice recorders, DJ

Portable Safety Radios

Medical – Portable Patient Monitoring

Automotive Audio

特色产品

  • ADSP-BF700: 200MHz, 128K L2 SRAM, 88-Lead LFCSP (QFN) Pkg
  • ADSP-BF702: 400MHz, 256K L2 SRAM, 88-Lead LFCSP (QFN) Pkg
  • ADSP-BF704: 400MHz, 512K L2 SRAM, 88-Lead LFCSP (QFN) Pkg
  • ADSP-BF706: 400MHz, 1M L2 SRAM, 88-Lead LFCSP (QFN) Pkg
  • ADSP-BF701: 200MHz, 128K L2 SRAM, DDR & ADC, 184-Ball CSP_BGA Pkg
  • ADSP-BF703: 400MHz, 256K L2 SRAM, DDR & ADC, 184-Ball CSP_BGA Pkg
  • ADSP-BF705: 400MHz, 512K L2 SRAM, DDR & ADC, 184-Ball CSP_BGA Pkg
  • ADSP-BF707: 400MHz, 1M L2 SRAM, DDR & ADC, 184-Ball CSP_BGA Pkg

特性和优势

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CrossCoreLogo-sm 
  • New, Enhanced Blackfin+ core with up to 400 MHz performance
    • Dual 16-bit or single 32-bit MAC support per cycle
    • 16-bit complex MAC and many other instruction set enhancements
    • Instruction set compatible with previous Blackfin products
  • Low system power
    • Best-in-Class Power Efficiency - less than100mW for 800MMACs performance
    • BF70x consumes 35% lower power than previous Blackfin products & up to 50% lower power than competing solutions
  • Memory
    • 136KB L1 SRAM/cache with multi-parity-bit protection
      • 64KB instruction, 64KB data, 8KB scratchpad
  • Large on-chip L2 SRAM with ECC protection, 128KB, 256KB, 512KB, 1MB variants
  • On-chip L2 ROM (512KB)
  • L3 interface (CSP_BGA only) for system memory expansion providing 16-bit interface to DDR2 or LPDDR SDRAM devices (up to 200 MHz)
  • Key Peripherals
    • Industry standard connectivity including USB2.0 HS, SDIO/eMMC, CAN 2.0
    • High Speed ePPI for glue-less video I/O
    • Multiple serial interfaces including SPORTs, Quad SPI, I2C, UARTs
    • Multi-channel ADC (CSP_BGA only)
  • Security and one-time-programmable memory
    • Crypto hardware accelerators
    • Fast secure boot for IP protection
    • memDMA encryption/decryption for fast run-time security
  • Low-cost packaging
    • 88-Lead LFCSP (QFN) package (12 mm × 12mm), RoHS compliant
    • 184-Ball CSP_BGA package (12 mm × 12mm × 0.8mm pitch), RoHS compliant

了解详情