ADG2128

量产

I²C CMOS 8 × 12模拟开关阵列，采用双/单电源供电

数据手册 (Rev. E) 产品选型表

产品模型: 5

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产品详情

I²C兼容接口
- 3.4 MHz高速I²C选项
32引脚LFCSP(5 mm × 5 mm)封装
双缓冲输入逻辑
多个开关同时更新

带宽最高达300 MHz
在双±5 V/单+12 V操作时完全指定
导通电阻：35 Ω（最大值）
低静态电流：< 20 μA
通过汽车应用认证

参考资料

数据手册 1

ADG2128: I²C^® CMOS 8 × 12 Unbuffered Analog Switch Array With Dual/Single Supplies Data Sheet (Rev.E) 04/04/2023

用户手册 1

UG-341: Evaluation Board—I²C, CMOS, 8 × 12 Analog Switch Array with Dual/Single Supplies 11/07/2011

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产品型号	引脚/封装图-中文版	文档	CAD 符号，脚注和 3D模型
ADG2128BCPZ-HS-RL7	32-Lead LFCSP (5mm x 5mm w/ EP)	Material Declaration Reliablity Data	Ultra Librarian SamacSys
ADG2128BCPZ-REEL	32-Lead LFCSP (5mm x 5mm w/ EP)	Material Declaration Reliablity Data	Ultra Librarian SamacSys
ADG2128BCPZ-REEL7	32-Lead LFCSP (5mm x 5mm w/ EP)	Material Declaration Reliablity Data	Ultra Librarian SamacSys
ADG2128WBCPZ-REEL7	32-Lead LFCSP (5mm x 5mm w/ EP)	Material Declaration Reliablity Data	Ultra Librarian SamacSys
ADG2128YCPZ-REEL7	32-Lead LFCSP (5mm x 5mm w/ EP)	Material Declaration Reliablity Data	Ultra Librarian SamacSys

产品型号	产品生命周期	PCN

11月 10, 2014 - 14_0047 Conversion of 5x5mm body Size LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines.
		PCN14_0047_Form Material_Report Detailed Change Description Package Outline Drawing Qualification Results Summary
ADG2128BCPZ-HS-RL7	量产
ADG2128BCPZ-REEL	量产
ADG2128BCPZ-REEL7	量产
ADG2128YCPZ-REEL7	量产
3月 23, 2012 - 11_0104 Conversion of Select Sizes of LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to ASE-Korea.
		PCN11_0104_Form Material_Report Qualification Report Summary Detailed Change Description Detailed Change Description Package Outline Drawing
ADG2128BCPZ-HS-RL7	量产
ADG2128BCPZ-REEL	量产
ADG2128BCPZ-REEL7	量产
ADG2128YCPZ-REEL7	量产
4月 12, 2010 - 09_0224 ADG2128, ADG2188, ADG2108, I2C interface change.
		PCN09_0224_Form Material_Report
ADG2128BCPZ-HS-RL7	量产
ADG2128BCPZ-REEL	量产
ADG2128BCPZ-REEL7	量产
ADG2128WBCPZ-REEL7	量产
ADG2128YCPZ-REEL7	量产
11月 16, 2009 - 06_0157 Qualification of the 8" H6 Thin Film BiPolar Wafer Fab Process at Analog Devices, Limerick, Ireland
		Material_Report PCN06_0157_Form RQR03599A
ADG2128BCPZ-HS-RL7	量产
ADG2128BCPZ-REEL	量产
ADG2128BCPZ-REEL7	量产
ADG2128WBCPZ-REEL7	量产
ADG2128YCPZ-REEL7	量产
2月 15, 2010 - 07_0061 LFCSP Package Manufacturing Line Transfer from Amkor Korea to Amkor PRC
		Material_Report Material_Report PCN_07_0061_RevB_China PCN_07_0061_RevB_Korea PCN07_0061_Form
ADG2128BCPZ-REEL	量产
5月 4, 2016 - 14_0178 Conversion of 3x3mm, 4x4mm and 5x5mm LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines
		PCN14_0178_Form Material_Report Detailed Change Description Package Outline Drawing Qualification Results Summary
ADG2128WBCPZ-REEL7	量产