AD640

量产

120 MHz、50dB解调对数放大器

数据手册 (Rev. D) 产品选型表

产品模型: 9

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产品详情

经过完全校准的完整单芯片系统
五级，各级均具有10 dB增益、350 MHz带宽
直接耦合的全差分信号路径
对数斜率、截距和交流响应在整个军用温度范围内保持稳定
以每10倍1 mA的比例调整的双极性电流输出
电压斜率操作（每10倍1 V、100 mV/dB等）
低功耗工作，±5 V时典型功耗为220 mW
同时提供低成本塑料封装

产品模型: 9

参考资料

ADI 始终高度重视提供符合最高质量和可靠性水平的产品。我们通过将质量和可靠性检查纳入产品和工艺设计的各个范围以及制造过程来实现这一目标。出货产品的“零缺陷”始终是我们的目标。查看我们的质量和可靠性计划和认证以了解更多信息。

产品型号	引脚/封装图-中文版	文档	CAD 符号，脚注和 3D模型
5962-9095502M2A	20-Lead LCC	Material Declaration Reliablity Data	Ultra Librarian SamacSys
5962-9095502MRA	20-Lead CerDIP (Side Brazed)	Material Declaration Reliablity Data	Ultra Librarian SamacSys
AD640BE	20-Lead LCC	Material Declaration Reliablity Data	Ultra Librarian SamacSys
AD640BPZ	20-Lead Flatpack	Material Declaration Reliablity Data	Ultra Librarian SamacSys
AD640JNZ	20-Lead PDIP	Material Declaration Reliablity Data	Ultra Librarian SamacSys
AD640JPZ-REEL7	20-Lead Flatpack	Material Declaration Reliablity Data	Ultra Librarian SamacSys
AD640TCHIPS	none available	Material Declaration Reliablity Data	Ultra Librarian SamacSys
AD640TD/883B	20-Lead CerDIP (Side Brazed)	Material Declaration Reliablity Data	Ultra Librarian SamacSys
AD640TE/883B	20-Lead LCC	Material Declaration Reliablity Data	Ultra Librarian SamacSys

产品型号	产品生命周期	PCN

1月 4, 2016 - 15_0269 AD640 - Specification Changes for Industrial and Military Temperature Grades
		PCN15_0269_Form Material_Report Detailed Change Description
AD640BE	量产
AD640BPZ	过期
AD640JNZ	量产
AD640JPZ-REEL7
AD640TCHIPS	量产
AD640TD/883B	量产
AD640TE/883B	量产
11月 9, 2011 - 11_0050 Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines
		PCN11_0050_Form Material_Report
AD640BE	量产
AD640TD/883B	量产
AD640TE/883B	量产
11月 9, 2011 - 11_0182 Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines
		PCN11_0182_Form Material_Report
AD640BE	量产
AD640TD/883B	量产
AD640TE/883B	量产
3月 7, 2019 - 19_0046 Assembly Transfer of 18,20,24,28 Lead PDIP to Cirtek
		PCN19_0046_Form Material_Report Detailed Change Description Qualification Results Summary
AD640JNZ	量产
8月 19, 2009 - 07_0024 Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad
		Material_Report Material_Report Parts List PCN07_0024_Form Qual Data
AD640JNZ	量产
4月 9, 2018 - 16_0026 Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices
		PCN16_0026_Form Material_Report Qualification Results Summary
AD640TD/883B	量产
AD640TE/883B	量产
6月 6, 2012 - 12_0066 Add capacity for Burn In of Hermetic, 883 & QMLQ/Class B devices at TSSI Cavite
		PCN12_0066_Form Material_Report Qualification Report Summary
AD640TD/883B	量产
AD640TE/883B	量产
12月 13, 2021 - 21_0106 Obsolesence of all Flatpack models of AD640 and AD641 (AD640BPZ, AD640JPZ, AD640JPZ-REEL7, AD641APZ)
		PDN21_0106_Form Material_Report
AD640BPZ	过期
AD640JPZ-REEL7