ADG819
PRODUCTION0.5 Ω CMOS 1.8 V to 5.5 V 2:1 Mux/SPDT Switch with BBM Switching Action
- Part Models
- 6
- 1ku List Price
- Starting From $1.25
Part Details
- Low On Resistance 0.8 O Max at 125°C
- 0.25 Ω Max On-Resistance Flatness
- +1.8 V to +5.5 V Single Supply
- 200 mA Current Carrying Capability
- Automotive Temperature Range: -40°C to +125°C
- Rail-to-Rail Operation
- Fast Switching Times
- 6-Lead SOT-23 Package, 8-Lead µSOIC
Package, and 6-Bump MicroCSP (Micro Chip Scale Package) - Typical Power Consumption (<0.01 µW)
- TTL/CMOS Compatible Inputs
- Pin Compatible with the ADG719
The ADG819 is a monolithic, CMOS SPDT (single pole, double throw) switch. This switch is designed on a submicron process, that provides low power dissipation yet gives high switching speed, low On Resistance and low leakage currents. Low-power consumption and operating supply range of +1.8 V to +5.5 V make the ADG819 ideal for battery-powered, portable instruments.
Each switch of the ADG819 conducts equally well in both directions when on. The ADG819 exhibits break-before- make switching action, thus preventing momentary shorting when switching channels. (See the ADG820 for a switch exhibiting make-before-break action.)
The ADG819 is available in a 6-lead SOT-23 package and an 8-lead µSOIC package as well as a 2×3 array MicroCSP package. This chip occupies only a 2.18mm × 1.14mm area, thus making it the ideal candidate for space-constrained applications.
Documentation
Data Sheet 1
User Guide 1
Application Note 1
Technical Articles 3
Product Selection Guide 1
Circuit Note 1
Rarely Asked Question Page 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
---|---|---|---|
ADG819BCBZ-REEL7 | 6-Ball WLCSP (1.14mm x 2.18mm) | ||
ADG819BRMZ | 8-Lead MSOP | ||
ADG819BRMZ-REEL7 | 8-Lead MSOP | ||
ADG819BRTZ-500RL7 | 6-Lead SOT-23 | ||
ADG819BRTZ-REEL | 6-Lead SOT-23 | ||
ADG819BRTZ-REEL7 | 6-Lead SOT-23 |
Part Models | Product Lifecycle | PCN |
---|---|---|
Nov 27, 2009 - 09_0244 ADG819 metal and via mask change |
||
ADG819BCBZ-REEL7 | PRODUCTION | |
ADG819BRMZ | PRODUCTION | |
ADG819BRMZ-REEL7 | PRODUCTION | |
ADG819BRTZ-500RL7 | PRODUCTION | |
ADG819BRTZ-REEL | PRODUCTION | |
ADG819BRTZ-REEL7 | PRODUCTION | |
Oct 26, 2015 - 15_0176 Assembly Transfer of Select 8/10L MSOP Products to Amkor Philippines |
||
ADG819BRMZ | PRODUCTION | |
ADG819BRMZ-REEL7 | PRODUCTION | |
Feb 8, 2010 - 04_0080 Qualification of the 8" C6 and Q Wafer Fab Processes at Analog Devices, Limerick, Ireland. |
||
ADG819BRMZ | PRODUCTION | |
ADG819BRMZ-REEL7 | PRODUCTION | |
ADG819BRTZ-500RL7 | PRODUCTION | |
ADG819BRTZ-REEL7 | PRODUCTION | |
May 15, 2012 - 10_0006 Halogen Free Material Change for mini SOIC Products |
||
ADG819BRMZ-REEL7 | PRODUCTION | |
Mar 27, 2019 - 18_0064 Bump Site Transfer and Qualification of Select 6L and 8L SOT23 Flip Chip on Lead Packages |
||
ADG819BRTZ-500RL7 | PRODUCTION | |
ADG819BRTZ-REEL | PRODUCTION | |
ADG819BRTZ-REEL7 | PRODUCTION | |
Apr 20, 2016 - 16_0021 Addition of Amkor Philippines as Alternate Assembly Site for 5L,6L and 8L SOT23 Packages |
||
ADG819BRTZ-500RL7 | PRODUCTION | |
ADG819BRTZ-REEL | PRODUCTION | |
ADG819BRTZ-REEL7 | PRODUCTION | |
Feb 4, 2010 - 10_0009 Halogen Free Material Change for SOT_23 Products |
||
ADG819BRTZ-500RL7 | PRODUCTION | |
ADG819BRTZ-REEL | PRODUCTION | |
ADG819BRTZ-REEL7 | PRODUCTION |
This is the most up-to-date revision of the Data Sheet.
Tools & Simulations
LTspice 1
Models for the following parts are available in LTspice:
- ADG819
SPICE Model 1
LTspice® is a powerful, fast and free simulation software, schematic capture and waveform viewer with enhancements and models for improving the simulation of analog circuits.