ADG3304

PRODUCTION

Low Voltage 1.15 V to 5.5 V, 4 Channel, Bidirectional, Logic Level Translator

Data Sheet (Rev. E) Product Selection Table

Part Models: 8
1ku List Price: Starting From $1.18

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Part Details

Bidirectional level translation
Operates from 1.15 V to 5.5 V
Low quiescent current < 1µA
No direction pin
Qualified for automotive applications

ADG3304-EP supports defense and aerospace applications (AQEC standard)

Download ADG3304-EP data sheet (pdf)
Military temperature range: −55°C to +125°C
See Data Sheet for more information

Part Models: 8
1ku List Price: Starting From $1.18

Documentation

ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.

Part Model	Pin/Package Drawing	Documentation	CAD Symbols, Footprints, and 3D Models
ADG3304BCBZ-REEL7	12-Ball WLCSP (1.61mm x 2.01mm)	Material Declaration Reliablity Data	Ultra Librarian SamacSys
ADG3304BCPZ-REEL	20-Lead LFCSP (4mm x 4mm w/ EP)	Material Declaration Reliablity Data	Ultra Librarian SamacSys
ADG3304BCPZ-REEL7	20-Lead LFCSP (4mm x 4mm w/ EP)	Material Declaration Reliablity Data	Ultra Librarian SamacSys
ADG3304BRUZ	14-Lead TSSOP	Material Declaration Reliablity Data	Ultra Librarian SamacSys
ADG3304BRUZ-REEL	14-Lead TSSOP	Material Declaration Reliablity Data	Ultra Librarian SamacSys
ADG3304BRUZ-REEL7	14-Lead TSSOP	Material Declaration Reliablity Data	Ultra Librarian SamacSys
ADG3304SRUZ-EP-RL7	14-Lead TSSOP	Material Declaration Reliablity Data	Ultra Librarian SamacSys
ADG3304WBRUZ-REEL	14-Lead TSSOP	Material Declaration Reliablity Data	Ultra Librarian SamacSys

Part Models	Product Lifecycle	PCN

Nov 14, 2012 - 12_0251 ADG3304 Datasheet Specification Change: Input Threshold Voltage Update
		PCN12_0251_Form Material_Report Datasheet Specification Comparison
ADG3304BCBZ-REEL7	PRODUCTION
ADG3304BCPZ-REEL	PRODUCTION
ADG3304BCPZ-REEL7	PRODUCTION
ADG3304BRUZ	PRODUCTION
ADG3304BRUZ-REEL	PRODUCTION
ADG3304BRUZ-REEL7	PRODUCTION
Feb 28, 2012 - 11_0175 Shipping Changes for WLCSP Products with 8mm Carrier Tape Width
		PCN11_0175_Form Material_Report Qualification Report Summary Detailed Parts List
ADG3304BCBZ-REEL7	PRODUCTION
Feb 8, 2010 - 04_0080 Qualification of the 8" C6 and Q Wafer Fab Processes at Analog Devices, Limerick, Ireland.
		PCN04_0080_Form Material_Report Reliability Report Reliability Report
ADG3304BCBZ-REEL7	PRODUCTION
ADG3304BCPZ-REEL	PRODUCTION
ADG3304BCPZ-REEL7	PRODUCTION
ADG3304BRUZ	PRODUCTION
ADG3304BRUZ-REEL	PRODUCTION
ADG3304BRUZ-REEL7	PRODUCTION
May 5, 2014 - 14_0020 Conversion of 4x4mm body Size LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines.
		PCN14_0020_Form Material_Report Detailed Change Description Package Outline Drawing Qualification Report Summary
ADG3304BCPZ-REEL	PRODUCTION
ADG3304BCPZ-REEL7	PRODUCTION
Apr 5, 2021 - 21_0035 Amkor Philippines as an Alternate Site for TSSOP_4.4
		PCN21_0035_Form Material_Report Qualification Results Summary Other
ADG3304BRUZ	PRODUCTION
ADG3304BRUZ-REEL	PRODUCTION
ADG3304BRUZ-REEL7	PRODUCTION
Jan 20, 2012 - 11_0218 Halogen Free Material Change for Certain TSSOP Products at Carsem
		PCN11_0218_Form Material_Report Qualification Report Summary
ADG3304BRUZ	PRODUCTION
ADG3304BRUZ-REEL	PRODUCTION
ADG3304BRUZ-REEL7	PRODUCTION
Jan 16, 2012 - 11_0244 Halogen Free Material Change for Select TSSOP Products Assembled at Amkor
		PCN11_0244_Form Material_Report Qualification Report Summary
ADG3304WBRUZ-REEL	PRODUCTION

This is the most up-to-date revision of the Data Sheet.

Tools & Simulations

IBIS Model 1

ADG3304 IBIS Model

Evaluation Kits

FPGA Mezzanine Card for Wireless Communications

Buy Now View Details

Features and Benefits

Includes schematics, layout, BOM, Gerber files, HDL, Linux^® drivers, IIO Oscilloscope, VisualANALOG
FMC-compatible form factor
Powered from FMC connector
Provides one channel of ADC and one channel of DAC with full synchronization capabilities

Product Details

This board is no longer available for ordering.

The AD-FMCOMMS1-EBZ high-speed analog module is designed to showcase the latest generation high-speed data converters. The AD-FMCOMMS1-EBZ provides the analog front-end for a wide range of compute-intensive FPGA-based radio applications.

The AD-FMCOMMS1-EBZ is an analog front end hardware platform that addresses a broad range of research, academic, industrial and defense applications. The AD-FMCOMMS1-EBZ enables RF applications from 400MHz to 4 GHz. The module is customizable to a wide range of frequencies by software without any hardware changes, providing options for GPS or IEEE 1588 Synchronization, and MIMO configurations.

When combined with the Xilinx ZYNQ^® Software-Defined Radio Kit, AD-FMCOMMS1-EBZ enables a variety of wireless communications functions at the physical layer, from baseband to RF. With up to 4 GB of flash storage space, 512 MB of RAM, Gigabit Ethernet interface (depending on the base platform) and a Linux image built specifically for the AD-FMCOMMS1-EBZ, you can get everything you need for a easy out of the box experience. The platform offers enough flexibility for many applications, and supports streaming data, and standard web interfaces to analyze transmitted RF data.

Applications

Electronic test and measurement equipment
General-purpose software radios
Radar systems
Ultra wideband satellite receivers
Point to point communication systems

Resources

AD-FMCOMMS1-EBZ User Guide

Software

IIO Oscilloscope Application

AD-FMCOMMS1-EBZ-Software

EVAL-14TSSOPEBZ Evaluation Board

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Features and Benefits

14-lead TSSOP evaluation board
Clamp allows the main device to be easily changed
Gold pin connectors allow the addition of passive components
SMB connectors for the input/output of signals
Additional space on-board to allow for prototyping

Product Details

The EVAL-14TSSOPEBZ evaluation board evaluates 14-lead TSSOP devices in the Switches and Multiplexers Portfolio that must be purchased separately from the evaluation board. A clamp is supplied with the EVAL-14TSSOPEBZ to secure a 14-lead TSSOP device to the evaluation board without the need for soldering, making the board reusable for multiple devices.

A 14-lead TSSOP device can be clamped or soldered to the center of the evaluation board. Each pin of the device that the eval board evaluates has a corresponding link from K1 to K14 that can be set to either VDD or GND. A wire screw terminal supplies VDD and GND. SMB connectors on the board allow additional external signals to be supplied to the device. In addition, there is space available at the top of the board for prototyping.

For full details, see the corresponding product data sheet, which must be used in conjunction with this user guide when using the evaluation board.