SSM2604
PRODUCTIONLow Power Audio Codec
- Part Models
- 2
- 1ku List Price
- Starting From $2.74
Part Details
- Stereo, 24-bit analog-to-digital and digital-to-analog converters
- DAC SNR: 100 dB (A-weighted), THD: −80 dB at 48 kHz, 3.3 V
- ADC SNR: 90 dB (A-weighted), THD: −80 dB at 48 kHz, 3.3 V
- Stereo line inputs
- Low power
- 7 mW stereo playback (1.8 V/1.5 V supplies)
- 14 mW record and playback (1.8 V/1.5 V supplies)
- Low supply voltages
- Analog: 1.8 V to 3.6 V
- Digital: 1.5 V to 3.6 V
- 256/384 oversampling rate in normal mode; 250/272 oversampling rate in USB mode
- Audio sampling rates: 8 kHz, 11.025 kHz, 12 kHz, 16 kHz, 22.05 kHz, 24 kHz, 32 kHz, 44.1 kHz, 48 kHz, 88.2 kHz, and 96 kHz
- 20-lead, 4 mm × 4 mm LFCSP (QFN) package
The SSM2604 is a low power, high quality stereo audio codec for portable digital audio applications with one set of stereo programmable gain amplifier (PGA) line inputs. It features two 24-bit analog-to-digital converter (ADC) channels and two 24-bit digital-to-analog (DAC) converter channels.
The SSM2604 can operate as a master or a slave. It supports various master clock frequencies, including 12 MHz or 24 MHz for USB devices; standard 256 fS or 384 fS based rates, such as 12.288 MHz and 24.576 MHz; and many common audio sampling rates, such as 96 kHz, 88.2 kHz, 48 kHz, 44.1 kHz, 32 kHz, 24 kHz, 22.05 kHz, 16 kHz, 12 kHz, 11.025 kHz, and 8 kHz.
The SSM2604 can operate at power supplies as low as 1.8 V for the analog circuitry and as low as 1.5 V for the digital circuitry. The maximum voltage supply is 3.6 V for all supplies.
The SSM2604 is specified over the industrial temperature range of −40°C to +85°C. It is available in a 20-lead, 4 mm × 4 mm lead frame chip scale package (LFCSP).
APPLICATIONS
- Mobile phones
- MP3 players
- Portable gaming
- Portable electronics
- Educational toys
Documentation
Data Sheet 1
Circuit Note 1
Analog Dialogue 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
---|---|---|---|
SSM2604CPZ-REEL | 20-Lead LFCSP (4mm x 4mm w/ EP) | ||
SSM2604CPZ-REEL7 | 20-Lead LFCSP (4mm x 4mm w/ EP) |
Part Models | Product Lifecycle | PCN |
---|---|---|
Oct 21, 2016 - 16_0229 Assembly Transfer of Select LFCSP Products to ASE Korea |
||
SSM2604CPZ-REEL | PRODUCTION | |
SSM2604CPZ-REEL7 | PRODUCTION | |
May 11, 2014 - 13_0231 Assembly Transfer of Select 4x4 and 5x5mm LFCSP Products to STATS ChipPAC China. |
||
SSM2604CPZ-REEL | PRODUCTION | |
SSM2604CPZ-REEL7 | PRODUCTION | |
Oct 26, 2011 - 11_0020 Conversion of Select Sizes of LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to StatsChippac Malaysia. |
||
SSM2604CPZ-REEL | PRODUCTION | |
SSM2604CPZ-REEL7 | PRODUCTION |
This is the most up-to-date revision of the Data Sheet.