SSM2211
PRODUCTIONLow Distortion, 1.5 W Audio Power Amplifier
- Part Models
- 5
- 1ku List Price
- Starting From $0.66
Part Details
- 1.5 W output with THD + N < 1%
- Differential bridge-tied load output
- Single-supply operation: 2.7 V to 5.5 V
- Functions down to 1.75 V
- Wide bandwidth: 4 MHz
- Highly stable phase margin: >80°
- Low distortion: 0.2% THD + N at 1 W output
- Excellent power supply rejection
The SSM2211 is a high performance audio amplifier that delivers 1 W rms of low distortion audio power into a bridge-connected 8 Ω speaker load (or 1.5 W rms into a 4 Ω load).
The SSM2211 operates over a wide temperature range and is specified for single-supply voltages between 2.7 V and 5.5 V. When operating from batteries, it continues to operate down to 1.75 V. This makes the SSM2211 the best choice for unregulated applications, such as toys and games.
Featuring a 4 MHz bandwidth and distortion below 0.2% total harmonic distortion plus noise (THD + N) at 1 W, superior performance is delivered at higher power or lower speaker load impedance than competitive units. Furthermore, when the ambient temperature is at 25°C, THD + N < 1%, and VS = 5 V on a 4-layer printed circuit board (PCB), the SSM2211 delivers a 1.5 W output.
The low differential dc output voltage results in negligible losses in the speaker winding and makes high value dc blocking capacitors unnecessary. The battery life is extended by using shutdown mode, which typically reduces quiescent current drain to 100 nA.
The SSM2211 is designed to operate over the −40°C to +85°C temperature range. The SSM2211 is available in 8-lead SOIC (narrow body) and LFCSP (lead frame chip scale) surface-mount packages. The advanced mechanical packaging of the LFCSP models ensures lower chip temperature and enhanced performance relative to standard packaging options.
Applications include personal portable computers, hands-free telephones and transceivers, talking toys, intercom systems, and other low voltage audio systems requiring 1 W output power.
Applications
- Portable computers
- Personal wireless communicators
- Hands-free telephones
- Speaker phones
- Intercoms
- Musical toys and talking games
Documentation
Data Sheet 1
Application Note 2
Analog Dialogue 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| SSM2211CPZ-REEL | 8-Lead LFCSP (3mm x 3mm w/ EP) | ||
| SSM2211CPZ-REEL7 | 8-Lead LFCSP (3mm x 3mm w/ EP) | ||
| SSM2211SZ | 8-Lead SOIC | ||
| SSM2211SZ-REEL | 8-Lead SOIC | ||
| SSM2211SZ-REEL7 | 8-Lead SOIC |
| Part Models | Product Lifecycle | PCN |
|---|---|---|
|
Jul 25, 2017 - 17_0068 CANCELLED: Addition of ASE Korea as an Alternate Assembly Site for Select 3x3mm and 4x4mm Body Sizes LFCSP Devices |
||
| SSM2211CPZ-REEL | PRODUCTION | |
| SSM2211CPZ-REEL7 | PRODUCTION | |
|
Feb 13, 2014 - 14_0038 Conversion of 3x3mm body Size LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines. |
||
| SSM2211CPZ-REEL | PRODUCTION | |
| SSM2211CPZ-REEL7 | PRODUCTION | |
|
Feb 8, 2010 - 04_0080 Qualification of the 8" C6 and Q Wafer Fab Processes at Analog Devices, Limerick, Ireland. |
||
| SSM2211CPZ-REEL | PRODUCTION | |
| SSM2211CPZ-REEL7 | PRODUCTION | |
| SSM2211SZ | PRODUCTION | |
| SSM2211SZ-REEL | PRODUCTION | |
| SSM2211SZ-REEL7 | PRODUCTION | |
|
Nov 23, 2010 - 10_0004 Halogen Free Material Change for SOIC Narrow Body Products Assembled at Amkor |
||
| SSM2211SZ | PRODUCTION | |
| SSM2211SZ-REEL | PRODUCTION | |
| SSM2211SZ-REEL7 | PRODUCTION | |
This is the most up-to-date revision of the Data Sheet.