ADSP-BF706
PRODUCTIONLow Power 400MHz Blackfin+ Embedded Processor with 1MByte L2 SRAM
- Part Models
- 4
- 1ku List Price
- Starting From $8.81
Part Details
- Blackfin+ core with up to 400 MHz performance
- Dual 16-bit or single 32-bit MAC support per cycle
- 16-bit complex MAC and many other instruction set enhancements
- Instruction set compatible with previous Blackfin products
- On-Chip Memory
- 136KB L1 SRAM with multi-parity-bit protection (64KB instruction, 64KB data, 8KB scratchpad)
- 1MByte on-chip L2 SRAM with ECC protection
- 512KByte On-chip L2 ROM
- Key Peripherals include
- USB2.0 HS OTG
- 2x CAN2.0B
- ePPI Video I/O
- 2x SPORTs (w/I2S)
- 2xQuad-SPI / 1xDual-SPI (w/ Host mode option)
- I2C
- 2xUART
- SD/SDIO/MMC (4-bit)
- Security and one-time-programmable memory
- Crypto hardware accelerators for fast secure boot/IP protection
- memDMA encryption/decryption for fast run-time security
- Low-cost packaging
- 88-Lead LFCSP (QFN) package (12 mm × 12mm), RoHS compliant
- Low system power with < 100 mW at 400 MHz (< 0.25 mW/MHz) at 25°C TJUNCTION
This device is a member of the ADSP-BF70x Blackfin Digital Signal Processor (DSP) product family. The new Blackfin+ processor core combines dual-MAC 16-bit, 32-bit MAC and 16-bit complex MAC in to a state-of-the-art signal processing engine. It also combines advantages of a clean, orthogonal RISC-like microprocessor instruction set, and single-instruction, multiple-data (SIMD) multimedia capabilities within a single instruction-set architecture. Further new enhancements to the Blackfin+ core add cache enhancements, branch prediction and other instruction set improvements—all while maintaining instruction set compatibility to previous Blackfin products.
The processor offers performance up to 400 MHz, as well as lowest power consumption at <100mW. Produced with a low-power and low-voltage design methodology, they provide world-class power management and performance.
By integrating a rich set of industry-leading system peripherals and large on-chip memory, this Blackfin processor is the platform of choice for next-generation applications that require RISC-like programmability, multimedia support, and leading-edge signal processing in one integrated package. These applications span a wide array of markets, from automotive systems to embedded industrial, instrumentation, video/image analysis, biometric and control applications.
Documentation
Data Sheet 1
User Guide 2
Application Note 12
Processor Manual 3
Product Highlight 1
Emulator Manual 2
Integrated Circuit Anomaly 1
Informational 1
Video 5
Product Highlight 1
Analog Dialogue 2
Thought Leadership Page 1
Webcast 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
---|---|---|---|
ADSP-BF706BCPZ-3 | 88-Lead LFCSP (12mm x 12mm w/ EP) | ||
ADSP-BF706BCPZ-4 | 88-Lead LFCSP (12mm x 12mm w/ EP) | ||
ADSP-BF706KCPZ-3 | 88-Lead LFCSP (12mm x 12mm w/ EP) | ||
ADSP-BF706KCPZ-4 | 88-Lead LFCSP (12mm x 12mm w/ EP) |
Part Models | Product Lifecycle | PCN |
---|---|---|
Apr 20, 2023 - 23_0018 Conversion of 12x12 LFCSP Package Outline from Punch to Sawn and Transfer of Assembly Site to UTAC Thailand |
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ADSP-BF706BCPZ-3 | PRODUCTION | |
ADSP-BF706BCPZ-4 | PRODUCTION | |
ADSP-BF706KCPZ-3 | PRODUCTION | |
ADSP-BF706KCPZ-4 | PRODUCTION | |
Sep 14, 2021 - 20_0257 CANCELLED: Assembly Site Transfer of Select LFCSP Products to UTAC Thailand |
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ADSP-BF706BCPZ-3 | PRODUCTION | |
ADSP-BF706BCPZ-4 | PRODUCTION | |
ADSP-BF706KCPZ-3 | PRODUCTION | |
ADSP-BF706KCPZ-4 | PRODUCTION | |
Jul 19, 2017 - 17_0134 ADSP-BF70x Data Sheet Update |
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ADSP-BF706BCPZ-3 | PRODUCTION | |
ADSP-BF706BCPZ-4 | PRODUCTION | |
ADSP-BF706KCPZ-3 | PRODUCTION | |
ADSP-BF706KCPZ-4 | PRODUCTION | |
Jun 22, 2016 - 16_0103 Die Revision 1.1 for ADSP-BF70x Blackfin Processor Products |
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ADSP-BF706BCPZ-3 | PRODUCTION | |
ADSP-BF706BCPZ-4 | PRODUCTION | |
ADSP-BF706KCPZ-3 | PRODUCTION | |
ADSP-BF706KCPZ-4 | PRODUCTION | |
Sep 25, 2015 - 15_0181 Data Sheet change for ADSP-BF70x |
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ADSP-BF706BCPZ-3 | PRODUCTION | |
ADSP-BF706BCPZ-4 | PRODUCTION | |
ADSP-BF706KCPZ-3 | PRODUCTION | |
ADSP-BF706KCPZ-4 | PRODUCTION |
This is the most up-to-date revision of the Data Sheet.
Software Resources
Middleware 1
CrossCore® Embedded Studio
CCES is a world-class integrated development environment (IDE) for the ADI Blackfin®, SHARC® and Arm® processor families.
View Details