AD5541
PRODUCTION2.7 V to 5.5 V, Serial-Input, Voltage-Output, 16-Bit DAC
- Part Models
- 10
- 1ku List Price
- Starting From $11.26
Part Details
- Full 16-bit performance
- 3 V and 5 V single-supply operation
- Low Power 0.625 mW power dissipation
- 1 μs settling time
- Unbuffered voltage output capable of driving 60 kΩ loads directly
- SPI-/QSPI-/MICROWIRE-compatible interface standards
- Power-on reset clears DAC output to 0 V (unipolar mode)
- 5 kV HBM ESD classification
- Low glitch: 1.1 nV-sec
The AD5541 / AD5542 are single, 16-bit, serial input, voltage output digital-to-analog converters (DACs) that operate from a single 2.7 V to 5.5 V supply. The DAC output range extends from 0 V to VREF.
The DAC output range extends from 0 V to VREF and is guaranteed monotonic, providing 1 LSB INL accuracy at 16 bits without adjustment over the full specified temperature range of −40°C to +85°C. Offering unbuffered outputs, the AD5541 / AD5542 achieve a 1 μs settling time with low power consumption and low offset errors. Providing a low noise performance of 11.8 nV/√Hz and low glitch, the AD5541 / AD5542 is suitable for deployment across multiple end systems.
The AD5542 can be operated in bipolar mode, which generates a ±VREF output swing. The AD5542 also includes Kelvin sense connections for the reference and analog ground pins to reduce layout sensitivity.
The AD5541 / AD5542 utilize a versatile 3-wire interface that is compatible with SPI, QSPI™, MICROWIRE™, and DSP interface standards. The AD5541 / AD5542 are available in 8-lead and 14-lead SOIC packages.
PRODUCT HIGHLIGHTS
- Single-Supply Operation. The AD5541 and AD5542 are fully specified and guaranteed for a single 2.7 V to 5.5 V supply.
- Low Power Consumption. These parts consume typically 0.625 mW with a 5 V supply and 0.375 mW at 3 V.
- 3-Wire Serial Interface.
- Unbuffered Output Capable of Driving 60 kΩ Loads. This reduces power consumption because there is no internal buffer to drive.
- Power-On Reset Circuitry.
APPLICATIONS
- Digital gain and offset adjustment
- Automatic test equipment
- Data acquisition systems
- Industrial process control
Documentation
Data Sheet 1
Application Note 1
Solutions Bulletin & Brochure 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
---|---|---|---|
AD5541ARZ | 8-Lead SOIC | ||
AD5541ARZ-REEL7 | 8-Lead SOIC | ||
AD5541BRZ | 8-Lead SOIC | ||
AD5541BRZ-REEL | 8-Lead SOIC | ||
AD5541CRZ | 8-Lead SOIC | ||
AD5541CRZ-REEL7 | 8-Lead SOIC | ||
AD5541JRZ | 8-Lead SOIC | ||
AD5541JRZ-REEL7 | 8-Lead SOIC | ||
AD5541LRZ | 8-Lead SOIC | ||
AD5541LRZ-REEL7 | 8-Lead SOIC |
Part Models | Product Lifecycle | PCN |
---|---|---|
Nov 23, 2010 - 10_0004 Halogen Free Material Change for SOIC Narrow Body Products Assembled at Amkor |
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AD5541ARZ | PRODUCTION | |
AD5541ARZ-REEL7 | PRODUCTION | |
AD5541BRZ | PRODUCTION | |
AD5541CRZ | PRODUCTION | |
AD5541CRZ-REEL7 | PRODUCTION | |
AD5541JRZ | PRODUCTION | |
AD5541JRZ-REEL7 | PRODUCTION | |
AD5541LRZ | PRODUCTION | |
AD5541LRZ-REEL7 | PRODUCTION | |
May 6, 2010 - 09_0271 AD5541/2 and AD5551/2 Alternative Wafer Fab Process |
||
AD5541ARZ | PRODUCTION | |
AD5541ARZ-REEL7 | PRODUCTION | |
AD5541BRZ | PRODUCTION | |
AD5541CRZ | PRODUCTION | |
AD5541CRZ-REEL7 | PRODUCTION | |
AD5541JRZ | PRODUCTION | |
AD5541JRZ-REEL7 | PRODUCTION | |
AD5541LRZ | PRODUCTION | |
AD5541LRZ-REEL7 | PRODUCTION | |
Sep 9, 2009 - 07_0083 Polyimide Change |
||
AD5541ARZ | PRODUCTION | |
AD5541ARZ-REEL7 | PRODUCTION | |
AD5541BRZ | PRODUCTION | |
AD5541CRZ | PRODUCTION | |
AD5541JRZ | PRODUCTION | |
AD5541JRZ-REEL7 | PRODUCTION | |
AD5541LRZ | PRODUCTION | |
AD5541LRZ-REEL7 | PRODUCTION | |
Aug 19, 2009 - 07_0024 Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad |
||
AD5541ARZ | PRODUCTION | |
AD5541ARZ-REEL7 | PRODUCTION | |
AD5541BRZ | PRODUCTION | |
AD5541CRZ | PRODUCTION | |
AD5541JRZ | PRODUCTION | |
AD5541JRZ-REEL7 | PRODUCTION | |
AD5541LRZ | PRODUCTION | |
AD5541LRZ-REEL7 | PRODUCTION |
This is the most up-to-date revision of the Data Sheet.
Hardware Ecosystem
Parts | Product Life Cycle | Description |
---|---|---|
AD5541A | PRODUCTION | 2.7 V to 5.5 V, Serial-Input, Voltage-Output, 16-/12-Bit nanoDAC in 8-lead 3 mm × 3 mm LFCSP |