ADF5001

数据手册 1

• ADF5001: 4 GHz to 18 GHz Divide-by-4 Prescaler Data Sheet (Rev.A) 06/14/2010

技术文章 1

• RF Meets Power Lines: Designing Intelligent Smart Grid Systems that Promote Energy Efficiency 03/05/2010

评估设计文件 1

• ADF500x Gerber 文件 06/10/2010

常见问题 1

• FAQ 10/25/2019

参考电路 1

• CN-0174 11/26/2010

产品选型指南 1

• RF、微波和毫米波IC选型指南 07/13/2018

ADI 始终高度重视提供符合最高质量和可靠性水平的产品。我们通过将质量和可靠性检查纳入产品和工艺设计的各个范围以及制造过程来实现这一目标。出货产品的“零缺陷”始终是我们的目标。查看我们的质量和可靠性计划和认证以了解更多信息。

产品型号	引脚/封装图-中文版	文档	CAD 符号，脚注和 3D模型
ADF5001BCPZ	16-Lead LFCSP (3mm x 3mm x 0.85mm w/ EP)	Material Declaration Reliablity Data	Ultra Librarian SamacSys
ADF5001BCPZ-RL7	16-Lead LFCSP (3mm x 3mm x 0.85mm w/ EP)	Material Declaration Reliablity Data	Ultra Librarian SamacSys

根据型号筛选

产品型号	产品生命周期	PCN
7月 5, 2022 - 21_0271 Qualification of an Alternate Adhesive Material and Molding Compound for Select LFCSP Packages
		PCN21_0271_Form Material_Report Detailed Change Description Qualification Results Summary
ADF5001BCPZ	量产
ADF5001BCPZ-RL7	量产
8月 1, 2016 - 16_0035 Assembly Relocation of Select LFCSP, Mini-LFCSP and LFCSP Side Solderable Products to STATS ChipPAC China Jiangyin
		PCN16_0035_Form Material_Report Qualification Results Summary Qualification Results Summary Qualification Results Summary
ADF5001BCPZ	量产
ADF5001BCPZ-RL7	量产
4月 28, 2014 - 13_0224 Assembly Transfer of Select 2x3 and 3x3mm LFCSP Products to STATS ChipPAC China.
		PCN13_0224_Form Material_Report Detailed Change Description Qualification Report Summary
ADF5001BCPZ	量产
ADF5001BCPZ-RL7	量产
6月 28, 2010 - 10_0158 Increase ADF5001 output power level from -8dBm typ. differental output power to -2dBm typ. The minimum output level increases from -12dBm to -7dBm. Branding change to small package code.
		PCN10_0158_Form Material_Report ADF5001 Final - High Power Edit
ADF5001BCPZ	量产
ADF5001BCPZ-RL7	量产