SW06
NOT RECOMMENDED FOR NEW DESIGNSQuad SPST JFET Analog Switch
- Part Models
- 9
- 1ku List Price
- Starting From $3.60
Part Details
The SW06 is a four channel single-pole, single-throw analog switch that employs both bipolar and ion-implanted FET devices. The SW06 FET switches use bipolar digital logic inputs which are more resistant to static electricity than CMOS devices. Ruggedness and reliability are inherent in the SW06 design and construction technology.
Increased reliability is complemented by excellent electrical specifications. Potential error sources are reduced by minimizing "ON" resistance and controlling leakage currents at high temperatures. The switching FET exhibits minimal RON variation over a 20 V analog signal range and with power supply voltage changes. Operation from a single positive power supply voltage is possible. With V+ = 36 V, V- = 0 V, the analog signal range will extend from ground to +32 V.
PNP logic inputs are TTL and CMOS compatible to allow the SW06 to upgrade existing designs. The logic "0" and logic "1" input currents are at microampere levels reducing loading on CMOS and TTL logic.
Documentation
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
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5962-89669012A | 20 ld LCC | ||
5962-8966901EA | 16-Lead CerDIP | ||
SW06BQ | 16-Lead CerDIP | ||
SW06BQ/883C | 16-Lead CerDIP | ||
SW06GPZ | 16-Lead PDIP | ||
SW06GQ | CERDIP GLASS SEAL | ||
SW06GSZ | 16-Lead SOIC Wide | ||
SW06GSZ-REEL | 16-Lead SOIC Wide | ||
SW06NBC | none available |
Part Models | Product Lifecycle | PCN |
---|---|---|
Apr 9, 2018 - 16_0026 Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices |
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5962-89669012A | PRODUCTION | |
5962-8966901EA | ||
SW06BQ/883C | PRODUCTION | |
Jun 6, 2012 - 12_0066 Add capacity for Burn In of Hermetic, 883 & QMLQ/Class B devices at TSSI Cavite |
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5962-89669012A | PRODUCTION | |
5962-8966901EA | ||
SW06BQ/883C | PRODUCTION | |
Nov 9, 2011 - 11_0050 Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines |
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5962-89669012A | PRODUCTION | |
5962-8966901EA | ||
SW06BQ | PRODUCTION | |
SW06BQ/883C | PRODUCTION | |
SW06GQ | PRODUCTION | |
Nov 9, 2011 - 11_0182 Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines |
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5962-89669012A | PRODUCTION | |
5962-8966901EA | ||
SW06BQ | PRODUCTION | |
SW06BQ/883C | PRODUCTION | |
SW06GPZ | PRODUCTION | |
SW06GQ | PRODUCTION | |
SW06GSZ | PRODUCTION | |
SW06GSZ-REEL | PRODUCTION | |
Jun 1, 2011 - 11_0088 Top and Bottom Mark Standardization for Certain LCC (Leadless Chip Carrier) and Metal Can Packages |
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5962-89669012A | PRODUCTION | |
Jul 31, 2009 - 09_0106 Removal of Die Fab Code from Topside Marking of Remaining Mil-Grade Products |
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5962-89669012A | PRODUCTION | |
5962-8966901EA | ||
SW06BQ/883C | PRODUCTION | |
Nov 7, 2012 - 12_0199 Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages. |
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5962-8966901EA | ||
SW06BQ | PRODUCTION | |
SW06BQ/883C | PRODUCTION | |
SW06GQ | PRODUCTION | |
Mar 29, 2021 - 21_0033 Assembly Site Transfer for 14/16L 300_MIL PDIP to Cirtek |
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SW06GPZ | PRODUCTION | |
Aug 19, 2009 - 07_0024 Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad |
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SW06GPZ | PRODUCTION | |
Aug 4, 2010 - 10_0117 Halogen Free Material Change for SOIC_W Products at Carsem |
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SW06GSZ | PRODUCTION | |
SW06GSZ-REEL | PRODUCTION |
This is the most up-to-date revision of the Data Sheet.