OP11S

PRODUCTION

Aerospace Quad Matched 741-Type Op Amp

Data Sheet Product Selection Table

Part Models: 2
1ku List Price: price unavailable

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Part Details

Guaranteed VOS: 500 μV maximum
Guaranteed matched CMRR: 94 dB minimum
Guaranteed matched VOS: 750 μV maximum
Low noise

Silicon-nitride passivation
Internal frequency compensation
Low crossover distortion
Continuous short-circuit protection
Low input bias current

Part Models: 2
1ku List Price: price unavailable

Documentation

Data Sheet 1

OP11S: Standard Military Drawing 08/10/2009
- OP11S Space Qualified Die Document

ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.

Part Model	Pin/Package Drawing	Documentation	CAD Symbols, Footprints, and 3D Models
5962-8980101VDA	14-Lead CerDIP	Material Declaration Reliablity Data	Ultra Librarian SamacSys
OP110000C	CHIPS OR DIE	Material Declaration Reliablity Data	Ultra Librarian SamacSys

Part Models	Product Lifecycle	PCN

Dec 11, 2018 - 18_0189 OP11S Aerospace Class S Models Change In Wafer Diameter
		PCN18_0189_Form Material_Report Qualification Plan
5962-8980101VDA
OP110000C
Jul 30, 2018 - 16_0026 Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices
		PCN16_0026_Form Material_Report Qualification Results Summary
5962-8980101VDA
OP110000C
Nov 18, 2015 - 15_0219 Laser Marking Standardization for Aerospace Packages
		PCN15_0219_Form Material_Report Qualification Results Summary
5962-8980101VDA
OP110000C
Oct 2, 2013 - 13_0163 Qualify TSSI Cavite, Phils for Burn-in and Life Test of MIL-PRF-38535 QMLV Aerospace Devices
		PCN13_0163_Form Material_Report Qualification Plan Summary
5962-8980101VDA
Nov 7, 2012 - 12_0199 Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.
		PCN12_0199_Form Material_Report Qualification Report Summary Datasheet Specification Comparison
5962-8980101VDA
Nov 9, 2011 - 11_0050 Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines
		PCN11_0050_Form Material_Report
5962-8980101VDA		PCN11_0050_Form Material_Report
Nov 9, 2011 - 11_0182 Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines
		PCN11_0182_Form Material_Report
5962-8980101VDA		PCN11_0182_Form Material_Report
Sep 21, 2009 - 09_0188 Change of Bottom Brand from Ink to Laser for Aerospace Cerpak Packages
		09_0188supportingInfo Material_Report PCN09_0188_Form
5962-8980101VDA		09_0188supportingInfo Material_Report PCN09_0188_Form
Feb 9, 2009 - 08_0073 Change of Seal Glass Material for Cerdip & Cerpak Packages
		08_0073AQualPlan Material_Report PCN08_0073_Form
5962-8980101VDA		08_0073AQualPlan Material_Report PCN08_0073_Form

This is the most up-to-date revision of the Data Sheet.

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OP11S

Part Details

Documentation

Data Sheet 1

High Dose Rate Radiation Reports 1

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