ADV7180
ADV7180
NOT RECOMMENDED FOR NEW DESIGNS10-Bit, 4× Oversampling SDTV Video Decoder
- Part Models
- 20
- 1ku List Price
- Starting From $4.87
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Part Details
- AEC-Q100 qualified for automotive applications
- Worldwide NTSC/PAL/SECAM color demodulation support
- One 10-bit ADC, 4× oversampling for CVBS, 2× oversampling for Y/C mode, and 2× oversampling for YPrPb (per channel)
- 3 video input channels with on-chip antialiasing filter
- CVBS (composite), Y/C (S-Video), and YPrPb (component) video input support
- 5-line adaptive comb filters and CTI/DNR video enhancement
- Mini-TBC functionality provided by adaptive digital line length tracking (ADLLT), signal processing, and enhanced FIFO management
- Integrated AGC with adaptive peak white mode
- Macrovision copy protection detection
- NTSC/PAL/SECAM autodetection
- 8-bit ITU-R BT.656 YCrCb 4:2:2 output and HS, VS, and FIELD; the 48-Lead LQFP, 40-lead LFCSP, and 32-lead LFCSP use one pin to output VS or FIELD.
- 1.0 V analog input signal range
- Full-featured VBI data slicer with teletext support (WST)
- Power-down mode and ultralow sleep mode current
- 2-wire serial MPU interface (I2C compatible)
- Single 1.8 V supply possible
- 1.8 V analog, 1.8 V PLL, 1.8 V digital, 1.8 V to 3.3 V I/O supply
- −10°C to +70°C commercial temperature grade
- −40°C to +85°C industrial/automotive qualified temperature grade
- −40°C to +125°C temperature grade for automotive qualified
- 4 package types
- 64-lead, 10 mm × 10 mm, RoHS compliant LQFP
- 48-Lead, 7 mm × 7 mm, RoHS compliant LQFP
- 40-lead, 6 mm × 6 mm, RoHS compliant LFCSP
- 32-lead, 5 mm × 5 mm, RoHS compliant LFCSP
The ADV7180 automatically detects and converts standard analog baseband television signals compatible with worldwide NTSC, PAL, and SECAM standards into 4:2:2 component video data compatible with the 8-bit ITU-R BT.656 interface standard.
The simple digital output interface connects gluelessly to a wide range of MPEG encoders, codecs, mobile video processors, and Analog Devices, Inc., digital video encoders, such as the ADV7391. External HS, VS, and FIELD signals provide timing references for LCD controllers and other video ASICs, if required. Accurate 10-bit analog-to-digital conversion provides professional quality video performance for consumer applications with true 8-bit data resolution. Three analog video input channels accept standard composite, S-video, or component video signals, supporting a wide range of consumer video sources. AGC and clamp-restore circuitry allow an input video signal peak-to-peak range to 1.0 V. Alternatively, these can be bypassed for manual settings.
The line-locked clock output allows the output data rate, timing signals, and output clock signals to be synchronous, asynchronous, or line locked even with ±5% line length variation. Output control signals allow glueless interface connections in many applications. The ADV7180 is programmed via a 2-wire, serial bidirectional port (I2C® compatible) and is fabricated in a 1.8 V CMOS process. Its monolithic CMOS construction ensures greater functionality with lower power dissipation. LFCSP package options makes the decoder ideal for space-constrained portable applications. A 64-lead LQFP package is pin compatible with the ADV7181C.
The 48-Lead LQFP, 40-lead LFCSP, and 32-lead LFCSP use one pin to output VS or FIELD.
Applications
- Digital camcorders and PDAs
- Low cost SDTV PIP decoder for digital TVs
- Multichannel DVRs for video security
- AV receivers and video transcoding
- PCI-/USB-based video capture and TV tuner cards
- Personal media players and recorders
- Smartphone/multimedia handsets
- In-car/automotive infotainment units
- Rearview camera/vehicle safety systems
Documentation
Data Sheet 1
Application Note 7
Technical Articles 2
Device Drivers 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
Part Models | Product Lifecycle | PCN |
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May 13, 2024 - 24_0009 Qualification of Alternative Wafer Fab for TSMC 0.18um Mixed Signal CMOS Process |
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ADV7180BCP32Z | PRODUCTION | |
ADV7180BCP32Z-RL | PRODUCTION | |
ADV7180BCPZ | PRODUCTION | |
ADV7180BCPZ-REEL | PRODUCTION | |
ADV7180BST48Z | PRODUCTION | |
ADV7180BST48Z-RL | PRODUCTION | |
ADV7180BSTZ | PRODUCTION | |
ADV7180BSTZ-REEL | PRODUCTION | |
ADV7180KCP32Z | PRODUCTION | |
ADV7180KCP32Z-RL | PRODUCTION | |
ADV7180KST48Z | PRODUCTION | |
ADV7180KST48Z-RL | PRODUCTION | |
ADV7180WBCP32Z | PRODUCTION | |
ADV7180WBCP32Z-RL | PRODUCTION | |
ADV7180WBST48Z | PRODUCTION | |
ADV7180WBST48Z-RL | PRODUCTION | |
ADV7180WBSTZ | PRODUCTION | |
ADV7180WBSTZ-REEL | PRODUCTION | |
Jun 5, 2014 - 13_0303 Assembly Transfer to Amkor Philippines and Test Transfer to STATS ChipPAC China of Select 5x5 LFCSP Products |
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ADV7180BCP32Z | PRODUCTION | |
ADV7180BCP32Z-RL | PRODUCTION | |
ADV7180KCP32Z | PRODUCTION | |
ADV7180KCP32Z-RL | PRODUCTION | |
Jun 26, 2023 - 23_0025 Package Outline Drawing and Data Sheet Revision for Select LFCSP Products in Amkor |
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ADV7180BCPZ | PRODUCTION | |
ADV7180BCPZ-REEL | PRODUCTION | |
Dec 7, 2016 - 16_0033 Assembly Relocation to Stats ChipPAC Jiangyin and Test Transfer to Stats ChipPAC Singapore of Select QFP Products |
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ADV7180BST48Z | PRODUCTION | |
ADV7180BST48Z-RL | PRODUCTION | |
ADV7180BSTZ | PRODUCTION | |
ADV7180BSTZ-REEL | PRODUCTION | |
ADV7180KST48Z | PRODUCTION | |
ADV7180KST48Z-RL | PRODUCTION | |
ADV7180WBST48Z | PRODUCTION | |
ADV7180WBST48Z-RL | PRODUCTION | |
ADV7180WBSTZ | PRODUCTION | |
ADV7180WBSTZ-REEL | PRODUCTION | |
Oct 22, 2009 - 09_0227 Metal2 mask edit for ADV7180BSTZ & ADV7180WBSTZ |
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ADV7180BSTZ | PRODUCTION | |
ADV7180BSTZ-REEL | PRODUCTION | |
ADV7180WBSTZ | PRODUCTION | |
ADV7180WBSTZ-REEL | PRODUCTION | |
Jan 5, 2009 - 07_0077 Certification of STATSChipPAC Shanghai, China and AMKOR Philippines as additional sources for Assembly & Test of QFP Packages |
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ADV7180BSTZ | PRODUCTION | |
ADV7180WBSTZ | PRODUCTION | |
ADV7180WBSTZ-REEL | PRODUCTION | |
Jun 25, 2014 - 13_0266 Test Transfer of Select LFCSP Products to STATS ChipPAC China |
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ADV7180WBCP32Z | PRODUCTION | |
ADV7180WBCP32Z-RL | PRODUCTION | |
May 1, 2024 - 24_0009 Qualification of Alternative Wafer Fab for TSMC 0.18um Mixed Signal CMOS Process |
||
ADV7180WBCPZ | PRODUCTION | |
ADV7180WBCPZ-REEL | PRODUCTION | |
Sep 10, 2014 - 14_0177 Conversion of 6x6mm LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines |
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ADV7180WBCPZ | PRODUCTION | |
ADV7180WBCPZ-REEL | PRODUCTION |
This is the most up-to-date revision of the Data Sheet.
Software Resources
Device Drivers 1
Evaluation Software 0
Hardware Ecosystem
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