ADG613
PRODUCTION1 pC Charge Injection, 100 pA Leakage, CMOS, ±5 V/ +5 V/ +3 V, Quad SPST Switches
- Part Models
- 4
- 1ku List Price
- Starting From $2.30
Part Details
- 1 pC charge injection
- ±2.7 V to ±5.5 V dual-supply operation
- +2.7 V to +5.5 V single-supply operation
- Automotive temperature range: −40°C to +125°C
- 100 pA maximum at 25°C leakage currents
- 85 Ω on resistance
- Rail-to-rail switching operation
- Fast switching times
- 16-lead TSSOP and SOIC packages
- Typical power consumption: <0.1 μW
- TTL-/CMOS-compatible inputs
ADG613-EP supports defense and aerospace applications (AQEC standard)
- Download ADG613-EP Data Sheet
- Military temperature range: −55°C to +125°C
- Controlled manufacturing baseline
- 1 assembly/test site
- 1 fabrication site
- Enhanced product change notification
- Qualification data available on request
- V62/16617 DSCC Drawing Number
The ADG613-EP is a monolithic CMOS device containing four independently selectable switches. This switch offers ultralow charge injection of 1 pC over the full input signal range and typical leakage currents of 0.01 nA at 25°C.
The device is fully specified for ±5 V, 5 V, and 3 V supplies. It contains four independent single-pole, single-throw (SPST) switches. The ADG613-EP contains two switches with digital control logic that turns on with logic low and two switches in which the logic is inverted.
Each switch conducts equally well in both directions when on and has an input signal range that extends to the supplies. The ADG613-EP exhibits break-before-make switching action.
The ADG613-EP is available in a small, 16-lead TSSOP package.
The ADG613-EP is also a TTL-compatible device.
Product Highlights
- Ultralow charge injection (1 pC typically).
- Dual ±2.7 V to ±5.5 V or single 2.7 V to 5.5 V operation.
- Temperature range: −55°C to +125°C.
- Small, 16-lead TSSOP.
Applications
- Automatic test equipment
- Data acquisition systems
- Battery-powered systems
- Communications systems
- Sample-and-hold systems
- Audio signal routing
- Relay replacement
- Avionics
Documentation
Data Sheet 3
User Guide 1
Technical Articles 3
Product Selection Guide 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| ADG613SRUZ-EP | 16-Lead TSSOP | ||
| ADG613SRUZ-EP-RL7 | 16-Lead TSSOP | ||
| ADG613YRUZ | 16-Lead TSSOP | ||
| ADG613YRUZ-REEL7 | 16-Lead TSSOP |
| Part Models | Product Lifecycle | PCN |
|---|---|---|
|
Feb 11, 2011 - 10_0005 Halogen Free Material Change for TSSOP Products Assembled at Amkor |
||
| ADG613YRUZ | PRODUCTION | |
| ADG613YRUZ-REEL7 | PRODUCTION | |
|
Feb 3, 2009 - 08_0001 Qualification of 8" 3um BiCMOS wafer fab process at Analog Devices, Limerick, Ireland. |
||
| ADG613YRUZ | PRODUCTION | |
| ADG613YRUZ-REEL7 | PRODUCTION | |
This is the most up-to-date revision of the Data Sheet.
Tools & Simulations
SPICE Model 1
Evaluation Kits
Evaluation Board for 16 lead TSSOP Devices in the Switch/Mux Portfolio