ADG417
PRODUCTIONLC2MOS, ±15 V Precision Mini-DIP SPST Switch
- Part Models
- 3
- 1ku List Price
- Starting From $1.67
Part Details
- 44 V Supply Maximum Ratings
- VSS to VDD Analog Signal Range
- Low On Resistance (<35Ω)
- Ultralow Power Dissipation (<35 µW)
- Break-Before-Make Switching Action
- Fast Switching Times
ton (160 ns max)
toff (100 ns max) - Plug-In Replacement for DG417
- 8-Lead DIP and SOIC Packages
The ADG417 is a monolithic CMOS SPST switch. This switch is designed on an enhanced LC2MOS process that provides low power dissipation yet gives high switching speed, low on resistance and low leakage currents.
The on resistance profile of the ADG417 is very flat over the full analog input range ensuring excellent linearity and low distortion. The part also exhibits high switching speed and high signal bandwidth. CMOS construction ensures ultralow power dissipation making the parts ideally suited for portable and battery powered instruments.
The ADG417 switch, which is turned ON with a logic low on the control input, conducts equally well in both directions when ON and has an input signal range that extends to the supplies. In the OFF condition, signal levels up to the supplies are blocked. The ADG417 exhibits break-before-make switching action for use in multiplexer applications. Inherent in the design is low charge injection for minimum transients when switching the digital input.
Applications
- Precision Test Equipment
- Precision Instrumentation
- Battery Powered Systems
- Sample Hold Systems
Documentation
Data Sheet 2
Application Note 1
Technical Articles 3
Product Selection Guide 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| ADG417BNZ | 8-Lead PDIP | ||
| ADG417BRZ | 8-Lead SOIC | ||
| ADG417BRZ-REEL | 8-Lead SOIC |
| Part Models | Product Lifecycle | PCN |
|---|---|---|
|
Aug 19, 2009 - 07_0024 Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad |
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| ADG417BNZ | PRODUCTION | |
|
Nov 23, 2010 - 10_0004 Halogen Free Material Change for SOIC Narrow Body Products Assembled at Amkor |
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| ADG417BRZ | PRODUCTION | |
| ADG417BRZ-REEL | PRODUCTION | |
|
Feb 8, 2010 - 04_0080 Qualification of the 8" C6 and Q Wafer Fab Processes at Analog Devices, Limerick, Ireland. |
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| ADG417BRZ | PRODUCTION | |
| ADG417BRZ-REEL | PRODUCTION | |
This is the most up-to-date revision of the Data Sheet.