ADG2188
PRODUCTIONI2C® CMOS 8 × 8 Unbuffered Analog Switch Array with Dual/Single Supplies
- Part Models
- 3
- 1ku List Price
- Starting From $5.17
Part Details
- I2C-compatible interface
- 3.4 MHz high speed I2C option
- 32-lead LFCSP_WQ (5 mm × 5 mm)
- Double-buffered input logic
- Simultaneous update of multiple switches
- Up to 300 MHz bandwidth
- Fully specified at dual ±5 V/single +12 V operation
- On resistance 35 Ω maximum
- Low quiescent current < 20 μA
- Qualified for automotive applications
The ADG2188 is an analog cross point switch with an array size of 8 × 8. The switch array is arranged so that there are eight columns by eight rows, for a total of 64 switch channels. The array is bidirectional, and the rows and columns can be configured as either inputs or outputs. Each of the 64 switches can be addressed and configured through the I2C-compatible interface. Standard, full speed, and high speed (3.4 MHz) I2C interfaces are supported. Any simultaneous switch combination is allowed. An additional feature of the ADG2188 is that switches can be updated simultaneously, using the LDSW command. In addition, a RESET option allows all of the switch channels to be reset/off. At power on, all switches are in the off condition. The device is packaged in a 32-lead, 5 mm × 5 mm LFCSP_WQ.
Applications
- AV switching in TV
- Automotive infotainment
- AV receivers
- CCTV
- Ultrasound applications
- KVM switching
- Telecom applications
- Test equipment/instrumentation
- PBX systems
Documentation
Data Sheet 1
User Guide 1
Product Selection Guide 2
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| ADG2188BCPZ-REEL7 | 32-Lead LFCSP (5mm x 5mm w/ EP) | ||
| ADG2188YCPZ-REEL7 | 32-Lead LFCSP (5mm x 5mm w/ EP) | ||
| ADW54012Z-0REEL7 | 32-Lead LFCSP (5mm x 5mm w/ EP) |
| Part Models | Product Lifecycle | PCN |
|---|---|---|
|
May 4, 2016 - 14_0178 Conversion of 3x3mm, 4x4mm and 5x5mm LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines |
||
| ADG2188BCPZ-REEL7 | PRODUCTION | |
| ADG2188YCPZ-REEL7 | PRODUCTION | |
| ADW54012Z-0REEL7 | PRODUCTION | |
|
Apr 2, 2013 - 12_0063 Conversion of Select Sizes of LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to ASE-Korea. |
||
| ADG2188BCPZ-REEL7 | PRODUCTION | |
| ADG2188YCPZ-REEL7 | PRODUCTION | |
|
Apr 12, 2010 - 09_0224 ADG2128, ADG2188, ADG2108, I2C interface change. |
||
| ADG2188BCPZ-REEL7 | PRODUCTION | |
| ADG2188YCPZ-REEL7 | PRODUCTION | |
|
Nov 16, 2009 - 06_0157 Qualification of the 8" H6 Thin Film BiPolar Wafer Fab Process at Analog Devices, Limerick, Ireland |
||
| ADG2188BCPZ-REEL7 | PRODUCTION | |
| ADG2188YCPZ-REEL7 | PRODUCTION | |
|
Feb 15, 2010 - 07_0061 LFCSP Package Manufacturing Line Transfer from Amkor Korea to Amkor PRC |
||
| ADG2188YCPZ-REEL7 | PRODUCTION | |
This is the most up-to-date revision of the Data Sheet.
Tools & Simulations
SPICE Model 1
IBIS Model 1
Evaluation Kits
ADG2188 Evaluation Board