ADG1409

PRODUCTION

4 Ω R_on, 4-Channel ±15 V/+12 V/±5 V iCMOS Multiplexer

Data Sheet (Rev. D) Product Selection Table

Part Models: 6
1ku List Price: Starting From $3.64

Viewing:

Part Details

4.7 Ω maximum on resistance at 25°C
0.5 Ω on-resistance flatness
Up to 190 mA continuous current
Fully specified at ±15 V/+12 V/±5 V

3 V logic-compatible inputs
Rail-to-rail operation
Break-before-make switching action
16-lead TSSOP and 4 mm × 4 mm LFCSP

Part Models: 6
1ku List Price: Starting From $3.64

Documentation

ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.

Part Model	Pin/Package Drawing	Documentation	CAD Symbols, Footprints, and 3D Models
ADG1409SRUZ-EP	16-Lead TSSOP	Material Declaration Reliablity Data	Ultra Librarian SamacSys
ADG1409SRUZ-EP-RL7	16-Lead TSSOP	Material Declaration Reliablity Data	Ultra Librarian SamacSys
ADG1409YCPZ-REEL7	16-Lead LFCSP (4mm x 4mm w/ EP)	Material Declaration Reliablity Data	Ultra Librarian SamacSys
ADG1409YRUZ	16-Lead TSSOP	Material Declaration Reliablity Data	Ultra Librarian SamacSys
ADG1409YRUZ-REEL	16-Lead TSSOP	Material Declaration Reliablity Data	Ultra Librarian SamacSys
ADG1409YRUZ-REEL7	16-Lead TSSOP	Material Declaration Reliablity Data	Ultra Librarian SamacSys

Part Models	Product Lifecycle	PCN

May 5, 2014 - 14_0020 Conversion of 4x4mm body Size LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines.
		PCN14_0020_Form Material_Report Detailed Change Description Package Outline Drawing Qualification Report Summary
ADG1409YCPZ-REEL7	PRODUCTION
Feb 15, 2010 - 07_0061 LFCSP Package Manufacturing Line Transfer from Amkor Korea to Amkor PRC
		Material_Report Material_Report PCN_07_0061_RevB_China PCN_07_0061_RevB_Korea PCN07_0061_Form
ADG1409YCPZ-REEL7	PRODUCTION
Jan 27, 2009 - 09_0013 Changes to Idd Specifications on ADG12xx, ADG14xx and ADG13xx datasheets
		Form Material_Report PCN attachment_ICMOS IDD changes
ADG1409YCPZ-REEL7	PRODUCTION
ADG1409YRUZ	PRODUCTION
ADG1409YRUZ-REEL	PRODUCTION
ADG1409YRUZ-REEL7	PRODUCTION
Oct 13, 2008 - 06_0084 Qualification of the 8" H Wafer Fab process at Analog Devices, Limerick, Ireland.
		06_0084RevB_PL Form Material_Report
ADG1409YCPZ-REEL7	PRODUCTION
ADG1409YRUZ	PRODUCTION
ADG1409YRUZ-REEL	PRODUCTION
ADG1409YRUZ-REEL7	PRODUCTION
Apr 5, 2021 - 21_0035 Amkor Philippines as an Alternate Site for TSSOP_4.4
		PCN21_0035_Form Material_Report Qualification Results Summary Other
ADG1409YRUZ	PRODUCTION
ADG1409YRUZ-REEL	PRODUCTION
ADG1409YRUZ-REEL7	PRODUCTION
Jan 20, 2012 - 11_0218 Halogen Free Material Change for Certain TSSOP Products at Carsem
		PCN11_0218_Form Material_Report Qualification Report Summary
ADG1409YRUZ	PRODUCTION
ADG1409YRUZ-REEL	PRODUCTION
ADG1409YRUZ-REEL7	PRODUCTION

This is the most up-to-date revision of the Data Sheet.

Hardware Ecosystem

Parts	Product Life Cycle	Description
ADG5409	RECOMMENDED FOR NEW DESIGNS	High Voltage Latch-up Proof 4-Channel Multiplexer

Tools & Simulations

LTspice 1

ADG1409 - Analog Switches Multiplexers

Models for the following parts are available in LTspice:

ADG1409

LTspice® is a powerful, fast and free simulation software, schematic capture and waveform viewer with enhancements and models for improving the simulation of analog circuits.

Evaluation Kits

Evaluation Board for the 16-Lead LFCSP Devices in the Switches and Multiplexers Portfolio

Buy Now View Details

Features and Benefits

16-lead, 4 mm × 4 mm LFCSP evaluation board
Easily changeable clamshell socket for the main device
Gold pin connectors for the addition of passive components
SMB connectors for the input and output of signals
Additional space on board for prototyping

Product Details

The EVAL-16LFCSPEBZ enables easy evaluation of the 16-lead lead frame chip scale package (LFCSP) devices in the Switches and Multiplexers Portfolio that are purchased separately. The EVAL-16LFCSPEBZ is supplied with a clamshell socket to secure a 16-lead LFCSP device to the evaluation board without the need for soldering. In addition, there are three sets of gold pin connectors in each trace, for board flexibility and reusability for multiple evaluations.

Figure 1 in the user guide shows the EVAL-16LFCSPEBZ. A 16-lead LFCSP device can be inserted into the socket in the center of the evaluation board. Each device pin has a corresponding three-pin header link, from K1 to K16. This can either be connected to an external signal source by removing the corresponding link or use the link to choose between V_DD or GND. A wire screw terminal, J5, supplies the V_DD and GND. The Subminiature Version B (SMB) connectors on the EVAL-16LFCSPEBZ allow additional external signals to be supplied to the device. In addition, there is a perfboard space and two 16-lead LFCSP pads (3 mm x 3 mm and 2.1 mm x 2.1 mm) available on top of the EVAL-16LFCSPEBZ for prototyping.

The full specifications of the device under test (DUT) are available in the corresponding product data sheet, which must be consulted with the EVAL-16LFCSPEBZ user guide when using the EVAL-16LFCSPEBZ.

Resources

UG-2093: Evaluation Board for the 16-Lead LFCSP Devices in the Switches and Multiplexers Portfolio (Rev.0)
562.19 K

Evaluation Board for 16 lead TSSOP Devices in the Switch/Mux Portfolio

Buy Now View Details

Features and Benefits

16 lead TSSOP evaluation board
Clamp to allow the main device to be changed easily
Gold pin connectors to allow the addition of passive components
SMB connectors for the input/output of signals
Additional space on board to allow for prototyping

Product Details

The EVAL-16TSSOPEBZ evaluation board evaluates 16-lead TSSOP devices in the Switches and Multiplexers Portfolio that are purchased separately. A clamp is supplied with the EVAL-16TSSOPEBZ to secure a 16-lead TSSOP device to the evaluation board without the need for soldering, making the board reusable for multiple devices.

A 16-lead TSSOP device can be clamped or soldered to the center of the evaluation board. Each pin of the device has a corresponding link from K1 to K16 that can be set to either VDD or GND. A wire screw terminal supplies VDD and GND. SMB connectors on the board allow additional external signals to be supplied to the device. In addition, there is space available at the top of the board for prototyping.

Full specifications of the device under test (DUT) are available in the corresponding product data sheet, which should be consulted in conjunction with this user guide when using the evaluation board.