AD830

PRODUCTION

High Speed, Video Difference Amplifier

Data Sheet (Rev. D) Product Selection Table

Part Models: 6
1ku List Price: Starting From $5.80

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Part Details

Differential amplification
Wide common-mode voltage range: +12.8 V to −12 V
Differential voltage: ±2 V
High CMRR: 60 dB at 4 MHz
Built-in differential clipping level: ±2.3 V
Fast dynamic performance

85 MHz unity gain bandwidth
35 ns settling time to 0.1%
360 V/μs slew rate
Symmetrical dynamic response
Excellent video specifications
See datasheet for additional features

Part Models: 6
1ku List Price: Starting From $5.80

Documentation

Data Sheet 2

AD830: High Speed, Video Difference Amplifier Data Sheet (Rev.D) 01/01/2000

AD830: Military Data Sheet 01/01/1999

Application Note 2

AN-282: Fundamentals of Sampled Data Systems 02/14/2015

AN-692: Universal Precision Op Amp Evaluation Board (Rev.A) 12/04/2003

ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.

Part Model	Pin/Package Drawing	Documentation	CAD Symbols, Footprints, and 3D Models
5962-9313001MPA	8-Lead CerDIP	Material Declaration Reliablity Data	Ultra Librarian SamacSys
AD830ANZ	8-Lead PDIP	Material Declaration Reliablity Data	Ultra Librarian SamacSys
AD830ARZ	8-Lead SOIC	Material Declaration Reliablity Data	Ultra Librarian SamacSys
AD830ARZ-REEL7	8-Lead SOIC	Material Declaration Reliablity Data	Ultra Librarian SamacSys
AD830JRZ	8-Lead SOIC	Material Declaration Reliablity Data	Ultra Librarian SamacSys
AD830JRZ-R7	8-Lead SOIC	Material Declaration Reliablity Data	Ultra Librarian SamacSys

Part Models	Product Lifecycle	PCN

Apr 9, 2018 - 16_0026 Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices
		PCN16_0026_Form Material_Report Qualification Results Summary
5962-9313001MPA
Nov 7, 2012 - 12_0199 Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.
		PCN12_0199_Form Material_Report Qualification Report Summary Datasheet Specification Comparison
5962-9313001MPA
Jun 6, 2012 - 12_0066 Add capacity for Burn In of Hermetic, 883 & QMLQ/Class B devices at TSSI Cavite
		PCN12_0066_Form Material_Report Qualification Report Summary
5962-9313001MPA
Nov 9, 2011 - 11_0050 Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines
		PCN11_0050_Form Material_Report
5962-9313001MPA		PCN11_0050_Form Material_Report
Nov 9, 2011 - 11_0182 Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines
		PCN11_0182_Form Material_Report
5962-9313001MPA		PCN11_0182_Form Material_Report
Aug 19, 2009 - 07_0024 Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad
		Material_Report Material_Report Parts List PCN07_0024_Form Qual Data
AD830ANZ	PRODUCTION

AD830

Part Details

Documentation

Data Sheet 2

Application Note 2

Analog Dialogue 2

Tools & Simulations

AD830 SPICE Macro Models 4

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