AD587
PRODUCTIONHigh Precision 10 V Reference
- Part Models
- 12
- 1ku List Price
- Starting From $4.43
Part Details
- Laser trimmed to high accuracy
10.000 V ± 5 mV (U grade) - Trimmed temperature coefficient
5 ppm/°C maximum (U grade)
- Noise-reduction capability
- Low quiescent current: 4 mA maximum
- Output trim capability
- MIL-STD-883-compliant versions available
The AD587 represents a major advance in state-of-the-art monolithic voltage references. Using a proprietary ion-implanted buried Zener diode and laser wafer trimming of high stability thin-film resistors, the AD587 provides outstanding performance at low cost.
The AD587 offers much higher performance than most other 10 V references. Because the AD587 uses an industry-standard pinout, many systems can be upgraded instantly with the AD587.
The buried Zener approach to reference design provides lower noise and drift than band gap voltage references. The AD587 offers a noise-reduction pin that can be used to further reduce the noise level generated by the buried Zener.
The AD587 is recommended for use as a reference for 8-bit, 10-bit, 12-bit, 14-bit, or 16-bit DACs that require an external precision reference. The device is also ideal for successive approximation or integrating ADCs with up to 14 bits of accuracy. In general, it offers better performance than standard on-chip references.
The AD587J and AD587K are specified for operation from 0°C to 70°C, and the AD587U is specified for operation from −55°C to +125°C. The AD587JQ and AD587UQ models are available in 8-lead CERDIP. Other models are available in an 8-lead SOIC package for surface-mount applications, or in an 8-lead PDIP.
PRODUCT HIGHLIGHTS
- Laser trimming of both initial accuracy and temperature coefficients. This laser trimming results in very low errors over temperature without the use of external components. The AD587U guarantees ±14 mV maximum total error between −55°C and +125°C.
- Optional fine trim connection. This connection is designed for applications requiring higher precision.
- Instant upgrade of any system using an industry-standard pinout 10 V reference.
- Very low output noise. AD587 output noise is typically 4 μV p-p. A noise-reduction pin is provided for additional noise filtering using an external capacitor.
- MIL-STD-883-compliant versions available. Refer to the Analog Devices Military/Aerospace Reference Manual for detailed specifications.
Documentation
Data Sheet 2
Frequently Asked Question 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| 5962-8982502PA | 8-Lead CerDIP | ||
| 5962-8982503PA | 8-Lead CerDIP | ||
| AD587JNZ | 8-Lead PDIP | ||
| AD587JQ | 8-Lead CerDIP | ||
| AD587JRZ | 8-Lead SOIC | ||
| AD587JRZ-REEL | 8-Lead SOIC | ||
| AD587JRZ-REEL7 | 8-Lead SOIC | ||
| AD587KNZ | 8-Lead PDIP | ||
| AD587KRZ | 8-Lead SOIC | ||
| AD587KRZ-REEL | 8-Lead SOIC | ||
| AD587KRZ-REEL7 | 8-Lead SOIC | ||
| AD587UQ | 8-Lead CerDIP |
| Part Models | Product Lifecycle | PCN |
|---|---|---|
|
Apr 9, 2018 - 16_0026 Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices |
||
| 5962-8982502PA | ||
| 5962-8982503PA | ||
|
Sep 7, 2017 - 17_0079 Qualification of TeamQuest Technology Inc., Philippines as an Alternate Test Site for TC-Vos Testing |
||
| 5962-8982502PA | ||
| 5962-8982503PA | ||
| AD587JNZ | PRODUCTION | |
| AD587JQ | ||
| AD587JRZ-REEL | PRODUCTION | |
| AD587KRZ-REEL | PRODUCTION | |
| AD587KRZ-REEL7 | PRODUCTION | |
| AD587UQ | PRODUCTION | |
|
Nov 7, 2012 - 12_0199 Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages. |
||
| 5962-8982502PA | ||
| 5962-8982503PA | ||
| AD587JQ | ||
| AD587UQ | PRODUCTION | |
|
Nov 9, 2011 - 11_0050 Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines |
||
| 5962-8982502PA | ||
| 5962-8982503PA | ||
| AD587JQ | ||
| AD587UQ | PRODUCTION | |
|
Nov 9, 2011 - 11_0182 Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines |
||
| 5962-8982502PA | ||
| 5962-8982503PA | ||
| AD587JNZ | PRODUCTION | |
| AD587JQ | ||
| AD587KNZ | PRODUCTION | |
| AD587UQ | PRODUCTION | |
|
Aug 19, 2009 - 07_0024 Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad |
||
| AD587JNZ | PRODUCTION | |
| AD587KNZ | PRODUCTION | |
This is the most up-to-date revision of the Data Sheet.
Tools & Simulations
AD587 SPICE Macro Models 8
- AD587 SPICE Macro Model Rev. A, 11/93
- AD587J SPICE Macro Model Rev. A, 11/93
- AD587K SPICE Macro Model Rev. A, 11/93
- AD587L SPICE Macro Model Rev. A, 11/93
- AD587S SPICE Macro Model Rev. A, 11/93
- AD587T SPICE Macro Model Rev. A, 11/93
- AD587U SPICE Macro Model Rev. A, 11/93
- AD587U SPICE Macro Model Rev. A, 11/93