OP27S

PRODUCTION

Aerospace Low Noise Precision Op Amp

Data Sheet (Rev. I) Product Selection Table

Part Models: 12
1ku List Price: Starting From $60.54

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Part Details

Low Noise
Low Drift: 0.2 µV/°C typical
High Speed:
2.8 V/µs Slew Rate, 8 MHz Gain Bandwidth

Low V_OS: 10 µV typical
Excellent CMRR:
126 dB at V_CM of ±11 V
High Open-Loop Gain: 1.8 Million

Part Models: 12
1ku List Price: Starting From $60.54

Documentation

Data Sheet 3

OP27S Space Qualified Die Data Sheet (Rev.I) 05/13/2008

OP27S Military Data Sheet 01/23/2024

OP27S Military Specification 01/23/2024

Cross Reference Guide 1

JAN to Generic Cross Reference 01/22/2009

ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.

Part Model	Pin/Package Drawing	Documentation	CAD Symbols, Footprints, and 3D Models
5962L9468003VHA	10-Lead FlatPack	Material Declaration Reliablity Data	Ultra Librarian SamacSys
5962R9468002V2A	20-Lead LCC	Material Declaration Reliablity Data	Ultra Librarian SamacSys
5962R9468002VGA	10 ld Flat Pack	Material Declaration Reliablity Data	Ultra Librarian SamacSys
5962R9468002VHA	10-Lead FlatPack	Material Declaration Reliablity Data	Ultra Librarian SamacSys
5962R9468002VPA	8-Lead CerDIP	Material Declaration Reliablity Data	Ultra Librarian SamacSys
JM38510/13503BGA	8 ld Header	Material Declaration Reliablity Data	Ultra Librarian SamacSys
JM38510/13503BPA	8-Lead CerDIP	Material Declaration Reliablity Data	Ultra Librarian SamacSys
JM38510/13503SGA	ROUND HEADER/METAL CAN	Material Declaration Reliablity Data	Ultra Librarian SamacSys
JM38510/13503SPA	8-Lead CerDIP	Material Declaration Reliablity Data	Ultra Librarian SamacSys
OP270000C	CHIPS OR DIE	Material Declaration Reliablity Data	Ultra Librarian SamacSys
OP27AL-EMX	10-Lead FlatPack	Material Declaration Reliablity Data	Ultra Librarian SamacSys
OP27R000C	CHIPS OR DIE	Material Declaration Reliablity Data	Ultra Librarian SamacSys

Part Models	Product Lifecycle	PCN

Jul 30, 2018 - 16_0026 Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices
		PCN16_0026_Form Material_Report Qualification Results Summary
5962L9468003VHA
5962R9468002V2A
5962R9468002VGA
5962R9468002VHA
5962R9468002VPA
JM38510/13503SGA
JM38510/13503SPA
OP270000C
OP27R000C
Oct 29, 2017 - 17_0079 Qualification of TeamQuest Technology Inc., Philippines as an Alternate Test Site for TC-Vos Testing
		PCN17_0079_Form Material_Report Test Correlation Report
5962L9468003VHA
5962R9468002V2A
5962R9468002VGA
5962R9468002VHA
5962R9468002VPA
JM38510/13503SGA
JM38510/13503SPA
Nov 18, 2015 - 15_0219 Laser Marking Standardization for Aerospace Packages
		PCN15_0219_Form Material_Report Qualification Results Summary
5962L9468003VHA
5962R9468002V2A
5962R9468002VGA
5962R9468002VHA
5962R9468002VPA
JM38510/13503BGA	PRODUCTION
JM38510/13503BPA	PRODUCTION
JM38510/13503SGA
JM38510/13503SPA
OP270000C
OP27R000C
Oct 2, 2013 - 13_0163 Qualify TSSI Cavite, Phils for Burn-in and Life Test of MIL-PRF-38535 QMLV Aerospace Devices
		PCN13_0163_Form Material_Report Qualification Plan Summary
5962L9468003VHA
5962R9468002V2A
5962R9468002VGA
5962R9468002VHA
5962R9468002VPA
JM38510/13503SGA
JM38510/13503SPA
Nov 7, 2012 - 12_0199 Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.
		PCN12_0199_Form Material_Report Qualification Report Summary Datasheet Specification Comparison
5962L9468003VHA
5962R9468002VHA
5962R9468002VPA
JM38510/13503BPA	PRODUCTION
JM38510/13503SPA
Nov 9, 2011 - 11_0050 Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines
		PCN11_0050_Form Material_Report
5962L9468003VHA
5962R9468002V2A
5962R9468002VGA
5962R9468002VHA
5962R9468002VPA
JM38510/13503BGA	PRODUCTION
JM38510/13503BPA	PRODUCTION
JM38510/13503SGA
JM38510/13503SPA
Nov 9, 2011 - 11_0182 Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines
		PCN11_0182_Form Material_Report
5962L9468003VHA
5962R9468002V2A
5962R9468002VGA
5962R9468002VHA
5962R9468002VPA
JM38510/13503BGA	PRODUCTION
JM38510/13503BPA	PRODUCTION
JM38510/13503SGA
JM38510/13503SPA
Jun 1, 2011 - 11_0088 Top and Bottom Mark Standardization for Certain LCC (Leadless Chip Carrier) and Metal Can Packages
		PCN11_0088_Form Material_Report Marking Comparison
5962R9468002V2A
JM38510/13503BGA	PRODUCTION
JM38510/13503SGA
Sep 29, 2022 - 22_0195 Shipment Carrier Change for TO-99 Header Package
		PCN22_0195_Form Material_Report Qualification Results Summary
5962R9468002VGA
JM38510/13503SGA
Sep 21, 2009 - 09_0188 Change of Bottom Brand from Ink to Laser for Aerospace Cerpak Packages
		09_0188supportingInfo Material_Report PCN09_0188_Form
5962R9468002VHA		09_0188supportingInfo Material_Report PCN09_0188_Form
Feb 9, 2009 - 08_0073 Change of Seal Glass Material for Cerdip & Cerpak Packages
		08_0073AQualPlan Material_Report PCN08_0073_Form
5962R9468002VHA
5962R9468002VPA
JM38510/13503SPA
Apr 9, 2018 - 16_0026 Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices
		PCN16_0026_Form Material_Report Qualification Results Summary
JM38510/13503BGA	PRODUCTION
JM38510/13503BPA	PRODUCTION
Jun 6, 2012 - 12_0066 Add capacity for Burn In of Hermetic, 883 & QMLQ/Class B devices at TSSI Cavite
		PCN12_0066_Form Material_Report Qualification Report Summary
JM38510/13503BGA	PRODUCTION
JM38510/13503BPA	PRODUCTION
Feb 1, 2010 - 09_0196 Change In Location of Q Compliance Indicator Location for JAN/38510 Product
		Material_Report PCN09_0196_Form QMarkSupportingInfo
JM38510/13503BGA	PRODUCTION
JM38510/13503BPA	PRODUCTION
JM38510/13503SGA
JM38510/13503SPA
Jul 31, 2009 - 09_0106 Removal of Die Fab Code from Topside Marking of Remaining Mil-Grade Products
		09_0106Supporting Material_Report PCN09_0106_Form
JM38510/13503BGA	PRODUCTION
JM38510/13503BPA	PRODUCTION

This is the most up-to-date revision of the Data Sheet.

Tools & Simulations

LTspice

Models for the following parts are available in LTspice:

OP27

LTspice® is a powerful, fast and free simulation software, schematic capture and waveform viewer with enhancements and models for improving the simulation of analog circuits.

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OP27S

Part Details

Documentation

Data Sheet 3

Cross Reference Guide 1

High Dose Rate Radiation Reports 1

Low Dose Rate Radiation Reports 1

Radiation Report 1

Tools & Simulations

LTspice

Models for the following parts are available in LTspice:

Latest Discussions

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