MUX08
NOT RECOMMENDED FOR NEW DESIGNS8-Channel JFET Analog Multiplexers (Overvoltage & Power Supply Loss Protected)
- Part Models
- 12
- 1ku List Price
- Starting From $8.84
Part Details
- JFET Switches Rather than CMOS
- Low "ON" Resistance: 220Ω
- Highly Resistant to Static Discharge Damage
- NO SCR Latch-Up Problems
- 125°C Temperature Tested Dice Available
- MUX-08 Pin Compatible with DG508, HI-508A, IH5108, IH6108, LF11508, 12508, 13508, AD7506
- See datasheet for additional features
The MUX-08 is a monolithic eight-channel analog multiplexer which connects a single output to one of the eight analog inputs depending upon the state of a 3-bit binary address.
The MUX-24 is a monolithic four-channel differential analog multiplexer configured in a double pole, four position (plus OFF) electronic switch array. A two-bit binary input address connects a pair of independent analog inputs from each four channel input section to the corresponding pair of independent analog outputs.
All switches in the MUX-08/MUX-24 are turned OFF by applying logic "0" to the ENABLE pin, thereby providing a package select function.
Fabricated with Precision Monolithics' high performance Bipolar-JFET technology, these devices offer low, constant "ON" resistance, low leakage currents and fast settling time with low crosstalk to satisfy a wide variety of applications.
These multiplexors do not suffer from latch-up or static charge blow-out problems associated with similar CMOS parts. The digital inputs are designed to operate form both TTL and CMOS levels while always providing a definite break-before-make action without the need for external pull-up resistors over the full operating temperature range.
Documentation
Data Sheet 2
Application Note 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
---|---|---|---|
5962-8771601EA | 16-Lead CerDIP | ||
5962-87716022A | 20-Lead LCC | ||
5962-8771602EA | 16-Lead CerDIP | ||
MUX08AQ/883C | 16-Lead CerDIP | ||
MUX08BQ/883C | 16-Lead CerDIP | ||
MUX08EPZ | 16-Lead PDIP | ||
MUX08EQ | 16-Lead CerDIP | ||
MUX08FPZ | 16-Lead PDIP | ||
MUX08FQ | 16-Lead CerDIP | ||
MUX08FSZ | 16-Lead SOIC | ||
MUX08NBC | none available | ||
MUX08NBCG:69 | CHIPS OR DIE |
Part Models | Product Lifecycle | PCN |
---|---|---|
Jun 24, 2019 - 19_0105 Electrical Datasheet Specification Limit Change |
||
5962-8771601EA | PRODUCTION | |
MUX08AQ/883C | ||
Apr 9, 2018 - 16_0026 Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices |
||
5962-8771601EA | PRODUCTION | |
5962-87716022A | ||
5962-8771602EA | ||
MUX08AQ/883C | ||
MUX08BQ/883C | ||
Nov 7, 2012 - 12_0199 Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages. |
||
5962-8771601EA | PRODUCTION | |
5962-8771602EA | ||
MUX08AQ/883C | ||
MUX08EQ | ||
MUX08FQ | ||
Jun 6, 2012 - 12_0066 Add capacity for Burn In of Hermetic, 883 & QMLQ/Class B devices at TSSI Cavite |
||
5962-8771601EA | PRODUCTION | |
5962-87716022A | ||
5962-8771602EA | ||
MUX08AQ/883C | ||
MUX08BQ/883C | ||
Nov 9, 2011 - 11_0050 Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines |
||
5962-8771601EA | PRODUCTION | |
5962-87716022A | ||
5962-8771602EA | ||
MUX08AQ/883C | ||
MUX08BQ/883C | ||
MUX08EQ | ||
MUX08FQ | ||
Nov 9, 2011 - 11_0182 Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines |
||
5962-8771601EA | PRODUCTION | |
5962-87716022A | ||
5962-8771602EA | ||
MUX08AQ/883C | ||
MUX08BQ/883C | ||
MUX08EPZ | PRODUCTION | |
MUX08EQ | ||
MUX08FPZ | PRODUCTION | |
MUX08FQ | ||
MUX08FSZ | PRODUCTION | |
Jul 31, 2009 - 09_0106 Removal of Die Fab Code from Topside Marking of Remaining Mil-Grade Products |
||
5962-8771601EA | PRODUCTION | |
5962-87716022A | ||
5962-8771602EA | ||
MUX08AQ/883C | ||
MUX08BQ/883C | ||
Jun 1, 2011 - 11_0088 Top and Bottom Mark Standardization for Certain LCC (Leadless Chip Carrier) and Metal Can Packages |
||
5962-87716022A | ||
Mar 29, 2021 - 21_0033 Assembly Site Transfer for 14/16L 300_MIL PDIP to Cirtek |
||
MUX08EPZ | PRODUCTION | |
Aug 19, 2009 - 07_0024 Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad |
||
MUX08EPZ | PRODUCTION | |
MUX08FPZ | PRODUCTION | |
Oct 5, 2010 - 10_0146 Halogen Free Material Change for 14/16L SOIC_N Products |
||
MUX08FSZ | PRODUCTION |
This is the most up-to-date revision of the Data Sheet.
Hardware Ecosystem
Parts | Product Life Cycle | Description |
---|---|---|
ADG5408 | RECOMMENDED FOR NEW DESIGNS | High Voltage Latch-up Proof 8-Channel Multiplexer |
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